The present invention relates to a method for purifying N-substituted maleimide. More particularly, the present invention adopts an evaporation apparatus, which can previously remove impurities having higher boiling points than the N-substituted maleimide after removing an organic solvent from an N-substituted maleimide resulting solution, thereby achieving effects of minimizing the pressure loss and polymerization loss, and obtaining high-purity N-substituted maleimide.

The present invention relates to a method for purifying N-substituted maleimide. More particularly, the present invention adopts an evaporation apparatus, which can previously remove impurities having higher boiling points than the N-substituted maleimide after removing an organic solvent from an N-substituted maleimide resulting solution, thereby achieving effects of minimizing the pressure loss and polymerization loss, and obtaining high-purity N-substituted maleimide.

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.

An object of the present disclosure is to provide a highly durable tire using a resin composition, and a solution to the problem is a tire obtained by using a resin composition containing a polyamide resin and an elastomer having a glass transition temperature of 25° C. or less, wherein the melt viscosity ν (Pa.Math.sec) at 240° C. and the average distance between elastomer interfaces, τ (μm), satisfy the relationship of the following expression (1):
ν<34.369τ.sup.−3.525  (1).

An object of the present disclosure is to provide a highly durable tire using a resin composition, and a solution to the problem is a tire obtained by using a resin composition containing a polyamide resin and an elastomer having a glass transition temperature of 25° C. or less, wherein the melt viscosity ν (Pa.Math.sec) at 240° C. and the average distance between elastomer interfaces, τ (μm), satisfy the relationship of the following expression (1):
ν<34.369τ.sup.−3.525  (1).

A method for manufacturing a heat resistant resin composition having superior dispersibility of maleimide-based copolymer, the method including: a melt-kneading step to melt and knead a maleimide-based copolymer (A) and at least one resin (B) selected from the group consisting of ABS resin, ASA resin, AES resin, and SAN resin with an extruder; wherein: a ratio of a melt viscosity of the maleimide-based copolymer (A) with respect to a melt viscosity of the resin (B) obtained with a shear rate of 120/sec and a cylinder temperature of a kneading unit of the extruder is 1.0 or higher and lower than 3.4, is provided.