C08L35/00

RESIN SHEET
20230097896 · 2023-03-30 ·

A resin sheet is formed of a resin composition containing a thermosetting component (A), in which the thermosetting component (A) contains a maleimide resin and a thermal diffusion rate of the resin sheet after being thermally cured is 1.25×10.sup.−6 m.sup.2/s or more, a peel strength of the resin sheet after being thermally cured is 2.0 N/10 mm or more.

RESIN SHEET
20230090587 · 2023-03-23 ·

A resin sheet is made using a resin composition containing a thermosetting component (A) and a thermally conductive filler (C). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0×10.sup.−6 m.sup.2/s or more. When a cross section (P) of the resin sheet taken by cutting the resin sheet in a vertical direction to a surface of the resin sheet is observed in an area (P1), a condition represented by a numerical formula (F1) below is satisfied, the area (P1) being defined by a square whose sides are four times as large as a thickness of the resin sheet and including two surfaces of the resin sheet,


0.25≤Ld/Lt≤1  (F1) where Ld is a vertical length of a filler particle having a largest cross-sectional diameter in the vertical direction of the thermally conductive filler (C), and Lt is a length of the resin sheet.

Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C). ##STR00001##
In the formula (1), R.sub.1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Each R.sub.3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 1 to 10.

Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C). ##STR00001##
In the formula (1), R.sub.1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Each R.sub.3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 1 to 10.

COMPOSITION FOR ELECTRICITY STORAGE DEVICES, SLURRY FOR ELECTRICITY STORAGE DEVICE ELECTRODES, ELECTRICITY STORAGE DEVICE ELECTRODE, AND ELECTRICITY STORAGE DEVICE

An electrical storage device may allow producing an electrical storage device electrode excellent in adhesiveness and with satisfactory charge-discharge durability characteristics. Such compositions for an electrical storage device may include: polymer particles (A); a polymer (B); and a liquid medium (C), wherein the polymer particles (A) each contain, with respect to 100 parts by mass in total of repeating units in the polymer particle (A), 20 to 65 parts by mass of a repeating unit (a1) derived from a conjugated diene compound, and 1 to 40 parts by mass of a repeating unit (a2) derived from an α,β-unsaturated nitrile compound, and wherein the polymer (B) contains, with respect to 100 parts by mass in total of repeating units contained in the polymer (B), 5 to 95 parts by mass of a repeating unit (b1) derived from an unsaturated carboxylic acid, and 5 to 95 parts by mass of a repeating unit (b2) derived from (meth)acrylamide.

BINDER FOR INORGANIC FIBERS AND INORGANIC FIBER MAT

The present invention provides a binder for inorganic fibers characterized by containing (A) 100 parts by mass of a polyvinyl alcohol-based resin having a degree of polymerization of 100-3500, (B) 1-50 parts by mass of a metal salt, and (C) 3 parts by mass of an ammonia denatured product of a copolymerization product containing maleic anhydride. By using the binder for inorganic fibers according to the present invention, it is possible to produce an inorganic fiber mat having a high recovery rate comparable to that of phenol resins. In addition, the amount of volatile organic compounds released from such an inorganic fiber mat is extremely low.

BINDER FOR INORGANIC FIBERS AND INORGANIC FIBER MAT

The present invention provides a binder for inorganic fibers characterized by containing (A) 100 parts by mass of a polyvinyl alcohol-based resin having a degree of polymerization of 100-3500, (B) 1-50 parts by mass of a metal salt, and (C) 3 parts by mass of an ammonia denatured product of a copolymerization product containing maleic anhydride. By using the binder for inorganic fibers according to the present invention, it is possible to produce an inorganic fiber mat having a high recovery rate comparable to that of phenol resins. In addition, the amount of volatile organic compounds released from such an inorganic fiber mat is extremely low.

Resin composition, laminate sheet, and multilayer printed wiring board

The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

Resin composition, laminate sheet, and multilayer printed wiring board

The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

A resin composition includes a modified poly(phenylene ether) compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in the molecule, and a styrene-based polymer having a weight-average molecular weight less than 10,000.