In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140° C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.

In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140° C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.

A composition comprising: (1) 0.1 to 84.0 wt % of a polymeric resin selected from PVC homopolymers, PVC copolymers, CPVC, PLA, SAN, ASA, CPE, EVA, ABS, MBS, polycarbonate, conventional acrylic ester polymers or mixtures thereof; and (2) 16.0 to 99.9 wt % of a polyacrylate resin/material (PAM) composition comprising a polymer (A) phase and a polymer (B) phase present in a ratio of polymer (A) phase/polymer (B) phase of 50/50 to 90/10, polymer (A), having a glass transition temperature Tg below −40° C., comprising 95.0 to 99.5 wt % of a first polymeric component (A1) of one or more mono-ethylenically unsaturated monomers selected from the group consisting of alkyl acrylates having an alkyl group containing from 1 to 8 carbons, and 0.5 to 5.0 wt % of a second polymeric component (A2) of one or more polyethylenically unsaturated monomers, where the double bonds can be of the same or differing reactivity; and polymer (B), having a glass transition temperature Tg above 85° C., comprising a first polymeric component (B1) of one or more monoethylenically unsaturated monomers selected from the group consisting of alkyl methacrylates having an alkyl group containing from 1 to 4 carbons, and optionally, 1.0 to 10.0 wt % of other monomers, based on the total weight of the (B1) component, selected from alkyl acrylates, vinylbenzene or substituted vinylbenzenes or mixtures thereof, and optionally a second polymeric component (B2) comprising 0.3 to 2.5 wt % based on the total weight of polymer (B) of one or more polyethylenically unsaturated monomers where the unsaturated bonds can be of the same or differing reactivity.

The present disclosure relates to a thermoplastic resin composition and a molded article including the same. The thermoplastic resin composition includes 10 to 70% by weight of a graft copolymer (A) including an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-1) containing acrylate rubber having an average particle diameter of 50 to 150 nm and an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-2) containing acrylate rubber having an average particle diameter of 300 to 600 nm; and 30 to 90% by weight of a non-grafted copolymer (B) including a high molecular weight aromatic vinyl compound-vinyl cyanide compound copolymer (B-1) having a weight average molecular weight of 160,000 to 200,000 g/mol and a low molecular weight aromatic vinyl compound-vinyl cyanide compound copolymer (B-2) having a weight average molecular weight of 80,000 g/mol or more and less than 160,000 g/mol.

Disclosed is a thermoplastic resin including an alkyl acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A), or an alkyl acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A) and a matrix resin (B) including one or more selected from the group consisting of an aromatic vinyl compound, a vinyl cyanide compound, an alkyl methacrylate, and an alkyl acrylate, wherein the total content of the alkyl acrylate is 20 to 50% by weight, and an alkyl acrylate coverage value (X) as calculated by Equation 1 below is 65 or more:

X={(G−Y)/Y}×100,   [Equation 1]

wherein G represents the total gel content (%) of the thermoplastic resin, and Y represents the content (% by weight) of the alkyl acrylate in the gel of the thermoplastic resin.

This disclosure relates to a thermoplastic resin composition comprising (A) 60 to 85 wt % of a (meth)acrylic resin, (B) 10 to 30 wt % of an acrylic graft copolymer, and (C) 5 to 10 wt % of a maleimide-based heat-resistant copolymer and a molded product using the same.

This disclosure relates to a thermoplastic resin composition comprising (A) 60 to 85 wt % of a (meth)acrylic resin, (B) 10 to 30 wt % of an acrylic graft copolymer, and (C) 5 to 10 wt % of a maleimide-based heat-resistant copolymer and a molded product using the same.

This disclosure relates to a thermoplastic resin composition comprising (A) 60 to 85 wt % of a (meth)acrylic resin, (B) 10 to 30 wt % of an acrylic graft copolymer, and (C) 5 to 10 wt % of a maleimide-based heat-resistant copolymer and a molded product using the same.

Described are polymerizable high energy light absorbing compounds of formula I: ##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, and X are as described herein. The compounds absorb various wavelengths of ultraviolet and/or high energy visible light and are suitable for incorporation in various products, such as biomedical devices and ophthalmic devices.

Described are polymerizable high energy light absorbing compounds of formula I: ##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, and X are as described herein. The compounds absorb various wavelengths of ultraviolet and/or high energy visible light and are suitable for incorporation in various products, such as biomedical devices and ophthalmic devices.