C08L63/00

Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same

The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same

The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

Particulate filler, preparation and use thereof
20230018717 · 2023-01-19 · ·

The present invention relates to a particulate filler which has a coating on support particles in each case surrounding the latter, which comprises a titanium dioxide doped with niobium and at least one further element, to a process for the preparation of a particulate filler of this type and to the use thereof, in particular as varistor filler having nonlinear electrical properties in coating compositions and moulding compounds.

Particulate filler, preparation and use thereof
20230018717 · 2023-01-19 · ·

The present invention relates to a particulate filler which has a coating on support particles in each case surrounding the latter, which comprises a titanium dioxide doped with niobium and at least one further element, to a process for the preparation of a particulate filler of this type and to the use thereof, in particular as varistor filler having nonlinear electrical properties in coating compositions and moulding compounds.

Chemical products for adhesive applications
11702538 · 2023-07-18 · ·

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

Chemical products for adhesive applications
11702538 · 2023-07-18 · ·

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

DENTAL ROOT CANAL FILLING COMPOSITION
20230014155 · 2023-01-19 · ·

The present invention is related to a dental root canal filling composition comprising at least one di- or polyepoxide; at least one primary monoamine; and at least one diamine; wherein the at least one primary monoamine comprises at least one cyclic non-aromatic hydrocarbon group and at least one primary amino group; wherein said at least one primary amino group is directly attached to said at least one cyclic non-aromatic hydrocarbon group; or wherein said at least one primary amino group is comprised by a hydrocarbon moiety, which is directly attached to said at least one cyclic non-aromatic hydrocarbon group.

DENTAL ROOT CANAL FILLING COMPOSITION
20230014155 · 2023-01-19 · ·

The present invention is related to a dental root canal filling composition comprising at least one di- or polyepoxide; at least one primary monoamine; and at least one diamine; wherein the at least one primary monoamine comprises at least one cyclic non-aromatic hydrocarbon group and at least one primary amino group; wherein said at least one primary amino group is directly attached to said at least one cyclic non-aromatic hydrocarbon group; or wherein said at least one primary amino group is comprised by a hydrocarbon moiety, which is directly attached to said at least one cyclic non-aromatic hydrocarbon group.