C08L73/00

POLYKETONE COMPOUND
20210395453 · 2021-12-23 ·

An aliphatic polyketone compound including 85.0 to 99.5 wt % aliphatic polyketone and 0.5 to 15.0 wt % ultra-high molecular weight polyethylene. An aliphatic polyketone compound described where the ultra-high molecular weight polyethylene is 2.0 to 8.0 wt %. An aliphatic polyketone compound where the ultra-high molecular weight polyethylene has a molecular weight greater than 1.0 million g/mol.

Conveyor Module, Small Fragments of Which are Magnetically and X-Ray Detectable

A conveyor module, small fragments of which are detectable by X-ray and/or magnetic sensors, is formed from a compounded mixture of a polyketone resin, a ferrous metal powder, and, optionally, a barium sulfate powder. The ferrous metal powder is preferably 400 series stainless steel powder, or alternatively, a 300 series stainless steel powder, iron powder, or other iron alloy powder.

Conveyor Module, Small Fragments of Which are Magnetically and X-Ray Detectable

A conveyor module, small fragments of which are detectable by X-ray and/or magnetic sensors, is formed from a compounded mixture of a polyketone resin, a ferrous metal powder, and, optionally, a barium sulfate powder. The ferrous metal powder is preferably 400 series stainless steel powder, or alternatively, a 300 series stainless steel powder, iron powder, or other iron alloy powder.

CYCLOHEXANE TRIESTER-BASED PLASTICIZER COMPOSITION AND RESIN COMPOSITION INCLUDING THE SAME
20220185988 · 2022-06-16 ·

The present disclosure relates to a plasticizer composition characterized in having alkyl groups derived from an isomer mixture of hexyl alcohol with the degree of branching of less than 2.0 as a cyclohexane triester. When the plasticizer composition is applied to a resin, stress resistance and mechanical properties may be maintained to equal or better levels, migration and loss properties and plasticization efficiency may keep balance, and light resistance and heat resistance may be markedly improved.

CYCLOHEXANE TRIESTER-BASED PLASTICIZER COMPOSITION AND RESIN COMPOSITION INCLUDING THE SAME
20220185988 · 2022-06-16 ·

The present disclosure relates to a plasticizer composition characterized in having alkyl groups derived from an isomer mixture of hexyl alcohol with the degree of branching of less than 2.0 as a cyclohexane triester. When the plasticizer composition is applied to a resin, stress resistance and mechanical properties may be maintained to equal or better levels, migration and loss properties and plasticization efficiency may keep balance, and light resistance and heat resistance may be markedly improved.

POLYMER BLENDS OF ALIPHATIC POLYKETONE, ACRYLONITRILE BUTADIENE STYRENE, AND FLAME RETARDANT
20230272208 · 2023-08-31 · ·

Embodiments of the present disclosure are directed to polymer blends comprising greater than or equal to 45 wt % and less than or equal to 90 wt % of an aliphatic polyketone; greater than or equal to 7.5 wt % and less than or equal to 40 wt % of an acrylonitrile butadiene styrene (ABS); and greater than 0 wt % and less than or equal to 25 wt % of a flame retardant.

POLYMER BLENDS OF ALIPHATIC POLYKETONE, ACRYLONITRILE BUTADIENE STYRENE, AND FLAME RETARDANT
20230272208 · 2023-08-31 · ·

Embodiments of the present disclosure are directed to polymer blends comprising greater than or equal to 45 wt % and less than or equal to 90 wt % of an aliphatic polyketone; greater than or equal to 7.5 wt % and less than or equal to 40 wt % of an acrylonitrile butadiene styrene (ABS); and greater than 0 wt % and less than or equal to 25 wt % of a flame retardant.

Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.

Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.

CRYSTALLINE ALUMINUM PHOSPHITE, PREPARATION METHOD AND APPLICATION THEREOF

The present invention discloses a crystalline aluminum phosphite, a preparation method thereof and an application thereof as or for the preparation of a flame retardant or a flame retardant synergist. The preparation method has the following processes: 1, reacting aluminum hydrogen phosphite with an aluminum-containing compound in water at 80-110° C. to obtain a precipitate in the presence of no strong acid or a small amount of strong acid; 2, washing and filtering the precipitate; 3, drying the precipitate at 100-130° C.; 4, continuously heating the dried solid step by step at a low speed, where the material temperature is increased to not exceeding 350° C. from room temperature at about 5-10 h, with a temperature rise rate not exceeding 5° C./min. Compared with amorphous aluminum hydrogen phosphite, the crystalline aluminum phosphite has a higher thermal decomposition temperature, lower water absorption and weaker acidity, and can be synergistic with diethyl aluminum hypophosphite to achieve better flame retardant property and thus, is used for a halogen-free flame retardant component of high polymer materials.