A polymerizable composition for 3D printing includes a photocurable polymer resin and metal diboride nanosheets. The resulting polymer nanocomposite includes a polymer matrix and metal diboride nanosheets dispersed throughout the polymer matrix. A method of synthesizing a nanomaterial-containing resin for 3D printing includes preparing a dispersion of metal diboride nanosheets in a solvent, and combining the dispersion with a liquid polymer resin to yield the nanomaterial-containing resin. A method of fabricating a nanocomposite structure from the nanomaterial-containing resin includes providing the nanomaterial-containing resin to a three-dimensional printer, forming a three-dimensional structure with the three-dimensional printer, and processing the three-dimensional structure to yield the nanocomposite structure.

A polypropylene composition comprising the following components in parts by weight: 40-99 parts of a polypropylene resin; 15-30 parts of an ethylene-α olefin copolymer; 0.2-1 part of an antimicrobial agent; and 1-3 parts of a polypropylene grafted polydimethylsiloxane is provided. By controlling a melt index of an elastomer, distribution of the modified polydimethylsiloxane and antimicrobial agent can be improved, thus improving antimicrobial and stain-resistant effects of the polypropylene composition.

A polypropylene composition comprising the following components in parts by weight: 40-99 parts of a polypropylene resin; 15-30 parts of an ethylene-α olefin copolymer; 0.2-1 part of an antimicrobial agent; and 1-3 parts of a polypropylene grafted polydimethylsiloxane is provided. By controlling a melt index of an elastomer, distribution of the modified polydimethylsiloxane and antimicrobial agent can be improved, thus improving antimicrobial and stain-resistant effects of the polypropylene composition.

A thermally conductive silicone potting composition that comprises, each in a preset amount, (A) an organopolysiloxane having at least two alkenyl groups per molecule and having a viscosity of 0.01-100 Pa.Math.s at 25° C., (B) an organopolysiloxane one end of which is blocked with an alkoxysilyl group, etc., (C) a crystalline silica having an average particle size of 0.1 μm or more and less than 5 μm, (D) a crystalline silica having an average particle size of 5 μm or more and less than 100 μm, (E) an organohydrogen siloxane having at least two SiH groups per molecule, and (F) a hydrosilylation reaction catalyst, wherein the mass ratio of (C)/(D) is from 3/1 to 1/10.

A thermally conductive silicone potting composition that comprises, each in a preset amount, (A) an organopolysiloxane having at least two alkenyl groups per molecule and having a viscosity of 0.01-100 Pa.Math.s at 25° C., (B) an organopolysiloxane one end of which is blocked with an alkoxysilyl group, etc., (C) a crystalline silica having an average particle size of 0.1 μm or more and less than 5 μm, (D) a crystalline silica having an average particle size of 5 μm or more and less than 100 μm, (E) an organohydrogen siloxane having at least two SiH groups per molecule, and (F) a hydrosilylation reaction catalyst, wherein the mass ratio of (C)/(D) is from 3/1 to 1/10.

Provided is an organopolysiloxane compound acting as a chain extender for use in a room-temperature-vulcanizing (RTV) composition of a dealcoholization type that can be rapidly turned into a rubber and then exhibit a rubber elasticity. The organopolysiloxane compound is represented by the following general formula (1), and also provided is a composition containing this compound and a linear diorganopolysiloxane with both molecular chain ends being blocked by a silanol group or a hydrolyzable silyl group,

##STR00001##

wherein each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 independently represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group having 6 to 10 carbon atoms; and n is a number of 0 to 10.

Provided is an organopolysiloxane compound acting as a chain extender for use in a room-temperature-vulcanizing (RTV) composition of a dealcoholization type that can be rapidly turned into a rubber and then exhibit a rubber elasticity. The organopolysiloxane compound is represented by the following general formula (1), and also provided is a composition containing this compound and a linear diorganopolysiloxane with both molecular chain ends being blocked by a silanol group or a hydrolyzable silyl group,

##STR00001##

wherein each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 independently represents a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group having 6 to 10 carbon atoms; and n is a number of 0 to 10.

A curable perfluoropolyether adhesive composition containing: (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by -C.sub.aF.sub.2aO- in a main chain; (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; (D) 0.05 to 5 parts by mass of an organosilicon compound, other than the component (B), having per molecule any two or more selected from a silicon-bonded hydrogen atom, an epoxy group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom, and a trialkoxysilyl group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom.

A curable perfluoropolyether adhesive composition containing: (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by -C.sub.aF.sub.2aO- in a main chain; (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; (D) 0.05 to 5 parts by mass of an organosilicon compound, other than the component (B), having per molecule any two or more selected from a silicon-bonded hydrogen atom, an epoxy group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom, and a trialkoxysilyl group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom.

Performance requirements of electroactive polymer materials used for transducer devices include dielectric breakdown strength, Young's modulus, dielectric constant, thickness, and electromechanical instability. There are correlation relationships therebetween but definitions of the correlation relationships have not been achieved. Therefore, it is necessary to search for an excellent material by trial and error, which requires a great deal of work. Disclosed herein is a curable elastomer composition that includes a compound having a high dielectric functional group. A cured product of the composition satisfies the following formula:

[00001]$E={\alpha \left(\frac{Y}{{\epsilon }_0{\epsilon }_r}\right)}^{0.5}$

where E is the dielectric breakdown strength in the range of 50 V/μm to 200 V/μm, α is a constant in the range of 0.4 to 0.9, Y is Young's modulus and is in the range of 0.001 MPa to 10 MPa, ε.sub.γ is a specific dielectric constant and is 100 or less, and ε.sub.0 represents the dielectric constant of vacuum.