The invention relates to formulations of aqueous dispersion adhesives on the basis of aqueous polyurethane or polyurethane-urea dispersions and the use of the adhesive formulations for bonding foam substrates according to the spray coagulation method.

A method of sealing pavement joints includes the steps of dispensing a first band of void reducing joint composition on a substrate. Applying a first pass of pavement over at least a portion of the void reducing joint composition. Dispensing a second pass of void reducing joint composition on the substrate. Applying a second pass of pavement of the second band of void reducing joint composition and against an edge of the first pass of pavement.

A method of sealing pavement joints includes the steps of dispensing a first band of void reducing joint composition on a substrate. Applying a first pass of pavement over at least a portion of the void reducing joint composition. Dispensing a second pass of void reducing joint composition on the substrate. Applying a second pass of pavement of the second band of void reducing joint composition and against an edge of the first pass of pavement.

Disclosed is a method for filling a root canal in a tooth. The method includes positioning a fiber in the root canal of the tooth, filling at least a portion of the root canal with an unset hydrogel composition, such that the unset hydrogel composition contacts at least a portion of the fiber, setting the hydrogel composition, thereby forming a set hydrogel, and removing the fiber from the set hydrogel, thereby leaving a channel in the set hydrogel. Methods and kits for repairing teeth are also described.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

The present disclosure provides a low-temperature thermal laminating film (10), and a preparation method and the use thereof. The low-temperature thermal laminating film (10) includes a film substrate (100) and an adhesive layer (200), wherein the adhesive layer (200) is disposed on the film substrate (100), and the raw materials of the adhesive layer (200) include an ethylene-vinyl acetate resin, a tackifier and an antioxidant, wherein the weight percentage of the ethylene-vinyl acetate resin is 70%-90%, the weight percentage of the tackifier is 5%-25%, and the weight percentage of the antioxidant is 3%-5%. The adhesive layer (200) in the low-temperature thermal laminating film (10) has a strong bonding force with the film substrate (100), and the low-temperature thermal laminating film can be laminated at relatively low-temperatures and can achieve a good laminating effect.

The present disclosure provides a low-temperature thermal laminating film (10), and a preparation method and the use thereof. The low-temperature thermal laminating film (10) includes a film substrate (100) and an adhesive layer (200), wherein the adhesive layer (200) is disposed on the film substrate (100), and the raw materials of the adhesive layer (200) include an ethylene-vinyl acetate resin, a tackifier and an antioxidant, wherein the weight percentage of the ethylene-vinyl acetate resin is 70%-90%, the weight percentage of the tackifier is 5%-25%, and the weight percentage of the antioxidant is 3%-5%. The adhesive layer (200) in the low-temperature thermal laminating film (10) has a strong bonding force with the film substrate (100), and the low-temperature thermal laminating film can be laminated at relatively low-temperatures and can achieve a good laminating effect.

Disclosed herein are processes for preparing a resin-extended rubber by mixing at least one thermoplastic resin with a resin-rubber-solvent cement comprising at least one conjugated diene monomer-containing rubber and the resin-extended rubber resulting from such processes. Also disclosed is a resin-extended rubber-solvent-cement comprising at least one conjugated diene monomer-containing rubber, at least one non-polar solvent, and at least one thermoplastic resin as well as a rubber composition comprising a resin-extended rubber.

Disclosed herein are processes for preparing a resin-extended rubber by mixing at least one thermoplastic resin with a resin-rubber-solvent cement comprising at least one conjugated diene monomer-containing rubber and the resin-extended rubber resulting from such processes. Also disclosed is a resin-extended rubber-solvent-cement comprising at least one conjugated diene monomer-containing rubber, at least one non-polar solvent, and at least one thermoplastic resin as well as a rubber composition comprising a resin-extended rubber.