A resin composition molded article forming an insulation layer of a direct-current power cable, including: a cross-linked base resin containing polyethylene, and an inorganic filler having a mean volume diameter of 80 nm or less, wherein at least a part of a surface of the inorganic filler includes an aminosilyl group having an amino group, and a light transmittance at a wavelength of 500 nm of a sheet is 70% or more, as measured under an atmosphere at 90, when the sheet is fabricated by cutting the resin composition molded article into 0.5 mm thickness.

A thermoplastic composition including a resin phase and 10% to 55%, especially 25% to 45% of glass fibers by weight of the composition is disclosed. The resin phase includes a polysiloxane block copolymer including polydimethylsiloxane blocks and polycarbonate blocks derived from bisphenol A. The resin phase further includes a polycarbonate and has between 2.0 wt % and 10 wt % by weight of siloxane. The thermoplastic composition has (i) a notched Izod impact strength of at least 150 Joules per meter measured at 23 C. according to ASTM D256, (ii) a tensile strength greater than 95 MPa as determined by ASTM D638, (iii) a tensile modulus greater than 10,900 MPa as determined by ASTM D638 and (iv) an unnotched Izod impact strength greater than 775 Joules per meter measured at 23 C. according to ASTM D256.

A liquid curable silicone elastomer composition is disclosed. The composition comprises: an organopolysiloxane (A) comprising: an organopolysiloxane (A1) containing at least 2 alkenyl groups bonded to silicon atom per molecule and having a total alkenyl content of from 0.01 to 1.5 mmol/g, and an organopolysiloxane (A2) containing at least 2 alkenyl groups bonded to silicon atom per molecule and having a total alkenyl content of from 5.0 to 15.0 mmol/g; an organopolysiloxane (B) comprising an organopolysiloxane (B1) containing at least 2 silicon-bonded hydrogen atoms per molecule provided by siloxy units of the type (R.sub.2HSiO.sub.1/2)x where R is independently selected from hydrogen, an aliphatic a hydrocarbyl, an aromatic hydrocarbyl, or an organyl group and x2; a platinum based catalyst (C); an inhibitor (D) selected from the group consisting of acetylenic alcohols and their derivatives; and a silica filler (E).

An aspect of the present invention is a resin composition comprising: an acrylic resin; and a curing agent, wherein the acrylic resin is a resin obtained by polymerizing monomer components comprising a first monomer represented by the following formula (1):

##STR00001##

wherein R.sup.1 represents a hydrogen atom or a methyl group, and R.sup.2 represents an alkyl group having 12 to 30 carbon atoms, and a second monomer copolymerizable with the first monomer and having a reactive group capable of reacting with the curing agent.

Provided is a thermally conductive member having excellent thermal resistance and insulating properties.

The thermally conductive member includes a silicone resin, a thermally conductive filler having a larger particle diameter from 30 m to 100 m, a thermally conductive filler having a smaller particle diameter of not greater than 10 m, and mica having a particle diameter of not greater than 10 m and an aspect ratio of not greater than 50. The mica is added at a ratio of from 0.9 to 11 parts by mass relative to 100 parts by mass of the silicone resin.

A scratch-resistant thermoplastic polymer composition (P) comprising 40 to 99.9 wt.-% of at least one styrene-based copolymer, 0.1 to 20 wt.-% of at least one inorganic metal compound nanoparticle, and optionally at least one polymeric compatibilizing agent, at least one modified polysiloxane compound, at least one colorant, dye or pigment, and/or at least one further additive has improved scratch properties.

Scratch-resistant thermoplastic polymer compositions (P) comprising 90 to 99.9 wt.-% of at least one styrene-based copolymer, 0.1 to 10 wt.-% of an aliphatic amide wax additive comprising at least one aliphatic amide wax composition having a melting point in the range of 80 C. to 115 C., and optionally at least one colorant, dye, pigment and/or further additive, have improved properties.

The present application relates to a polypropylene composition having a melt flow rate MFR.2 (230 C.) measured according to ISO 1133 in the range of 5 to 50 g/10 min, to a composition comprising the polypropylene composition and one or more additive(s) in an amount of up to 4 wt.-%, based on the total weight of the composition, to a process for the preparation of the polypropylene composition and an article comprising the polypropylene composition as well as the use of the polypropylene composition for decreasing the brittle-to-ductile transition temperature.

Disclosed are: a polyalkylene terephthalate resin composition comprising (A) a polyalkylene terephthalate resin and (B) an acrylic-based core-shell polymer which has an average particle size of 2 m or greater and in which an amount of the core layer component is more than 80% by mass but less than 100% by mass relative to a total mass of the core layer component and a shell layer component; and a molded article which is obtained by molding the polyalkylene terephthalate resin composition.

A thermoplastic resin (A) including, in its main chain structure, a unit (i) having a biphenyl group, a unit (ii) having a substituent biphenyl group, a unit (iii) having a specific number of atoms in its main chain, and a unit (iv) having a specific number of atoms in its main chain provides a thermoplastic resin which has a low liquid crystal phase transition temperature and a low isotropic phase transition temperature, is highly thermally conductive, and can be processed by molding at a low melting temperature.