The present disclosure provides minimum-boiling, homogeneous azeotropic and azeotrope-like compositions of 1,2,2-trifluoro-1-trifluoromethylcyclobutane (“TFMCB”) with each of ethanol, n-pentane, cyclopentane, trans-1,2-dichloroethylene, and perfluoro(2-methyl-3-pentanone).

A composition for paint removal and methods of making and of using the composition are provided. The composition comprises tetrahydrofuran (THF), an amine with a molar volume of <100 cm.sup.3/mol, and a solvent.

The invention discloses a novel solution and process comprising a modified solvent for providing enhanced blade edge attributes.

A method for removing ink and/or a foreign material different from ink from the surface of an article, wherein at least a part of the surface of the article comprises a polymer, the method includes: i) providing an ink imprinted article and/or an article having a surface covered at least partly by a foreign material different from ink; ii) contacting the article provided in step i) with an acid having a pKa in the range from −10 to 7 having a minimum concentration of 1 wt.-% for solving the ink and/or the foreign material different from ink or their degradation products in the acid; iii) separating the acid and the therein dissolved ink- and/or foreign material different from ink or their degradation products from the article to obtain a deinked article and/or an article with a surface free from foreign material.

A method for removing ink and/or a foreign material different from ink from the surface of an article, wherein at least a part of the surface of the article comprises a polymer, the method includes: i) providing an ink imprinted article and/or an article having a surface covered at least partly by a foreign material different from ink; ii) contacting the article provided in step i) with an acid having a pKa in the range from −10 to 7 having a minimum concentration of 1 wt.-% for solving the ink and/or the foreign material different from ink or their degradation products in the acid; iii) separating the acid and the therein dissolved ink- and/or foreign material different from ink or their degradation products from the article to obtain a deinked article and/or an article with a surface free from foreign material.

Disclosed herein are a solvent composition and methods of using the solvent composition. The solvent composition includes at least 80 wt. % of trans-1,2-dichloroetheylene (t-DCE), and 0.1 to 20 wt. % of at least one organic compound. The organic compound may be a hydrocarbon and/or an oxygenated solvent. The solvent composition may be used to clean a surface by contacting the surface with the composition to dissolve a contaminant on the surface. The composition may be used to remove a coating from a surface of a substrate by contacting the surface with the solvent composition to dissolve the coating and removing the composition containing the coating from the surface. The composition may also be used to deposit material on a substrate by dissolving the material in the solvent composition, applying the composition containing the material onto the substrate, and evaporating the composition from the substrate.

Provided is a composition which has an excellent affinity with the surface of an adhesive agent and can achieve a high etching rate. The composition according to one embodiment comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and, as an aprotic solvent, (A) an N-substituted amide compound having no active hydrogen on a nitrogen atom, and (B) a dipropylene glycol dimethyl ether, wherein (B) the dipropylene glycol dimethyl ether has the percentage of a structural isomer represented by formula (1) of at least 50 mass % with respect to the total amount of (B) the dipropylene glycol dimethyl ether.

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The present disclosure relates to a process solution composition for polymer treatment comprising: a fluorine compound; a ketone-based solvent; and a polar aprotic solvent, wherein the ketone-based solvent is one or more selected from the group consisting of compounds represented by Chemical Formula 1 or Chemical Formula 2, and has an effect capable of preventing damage to various types of metals while improving the power of removing an adhesive polymer remaining on the wafer circuit surface in a semiconductor manufacturing process.

Disclosed are antimicrobial sacrificial floor coatings systems including an antimicrobial sacrificial floor coating composition capable of reducing and/or preventing gram positive and gram negative bacterial growth on floors.

Disclosed are antimicrobial sacrificial floor coatings systems including an antimicrobial sacrificial floor coating composition capable of reducing and/or preventing gram positive and gram negative bacterial growth on floors.