Patent classifications
C09D115/00
Dielectric film, method for manufacturing the same, and transducer including the same
A dielectric film includes an elastomer and nanoparticles dispersed in the elastomer while chemically bound to the elastomer. The nanoparticles have cyano groups and are manufactured by a sol-gel process using an organometallic compound. A method for manufacturing a dielectric film includes: producing a chelate compound of an organometallic compound; producing a sol of metallic oxide particles having cyano groups by adding a silane coupling agent having a cyano group, an organic solvent, and water to the chelate compound; preparing a mixed solution by mixing the sol of the metallic oxide particles having cyano groups and a polymer solution containing a rubber polymer having a functional group capable of reacting with a hydroxy group; and forming a dielectric film by applying the mixed solution to a substrate and by curing a coating film.
Coating agent for oil seal
A coating agent for oil seal comprising 10 to 90 parts by weight in total of fluororesin particles having a particle size of 2 m or less and filler particles other than fluororesin particles having a particle size of 0.5 to 30 m, and 10 to 40 parts by weight of a wax having a melting point of 40 to 160 C., based on 100 parts by weight of isocyanate group-containing 1,2-polybutadiene, and being prepared as an organic solvent solution, wherein the fluororesin particles are used at a ratio of 20 to 80 wt. % of the total filler amount. The coating agent for oil seal can improve abrasion resistance while maintaining the roughness of a coating surface to which the coating agent is applied.
COMPOSITION FOR ELECTROCHEMICAL DEVICE AND METHOD OF PRODUCING SAME, BINDER COMPOSITION FOR ELECTROCHEMICAL DEVICE, CONDUCTIVE MATERIAL DISPERSION LIQUID FOR ELECTROCHEMICAL DEVICE, SLURRY FOR ELECTROCHEMICAL DEVICE ELECTRODE, ELECTRODE FOR ELECTROCHEMICAL DEVICE, AND ELECTROCHEMICAL DEVICE
A composition for an electrochemical device contains a polymer that includes a nitrile group-containing monomer unit and either or both of a conjugated diene monomer unit and an alkylene structural unit and that has a structure derived from a specific compound on at least one terminal. The composition has a concentration of divalent or higher-valent metal ions of not less than 5 mass ppm and not more than 4,000 mass ppm.
RESIN COMPOSITION, ARTICLE MADE THEREFROM AND USE THEREOF
A resin composition, an article made therefrom and a use thereof are provided. The resin composition includes: 100 parts by weight of a maleic anhydride-modified polyolefin; 5 to 40 parts by weight of a maleimide resin; and 30 to 90 parts by weight of an acrylate monomer, its oligomer or a combination thereof, the acrylate monomer having two or more unsaturated CC double bonds. The resin composition may be used to fabricate different articles and may be used in a printed circuit board hole-plugging process or a printed circuit board circuit filling process. The resin composition or the article made therefrom may achieve improvements in one or more properties including varnish shelf life, percent of organic volatile matters, dissipation factor, glass transition temperature, percent of thermal expansion in Z-axis, copper foil peeling strength, water absorption ratio and percent of cure shrinkage.
RESIN COMPOSITION, ARTICLE MADE THEREFROM AND USE THEREOF
A resin composition, an article made therefrom and a use thereof are provided. The resin composition includes: 100 parts by weight of a maleic anhydride-modified polyolefin; 5 to 40 parts by weight of a maleimide resin; and 30 to 90 parts by weight of an acrylate monomer, its oligomer or a combination thereof, the acrylate monomer having two or more unsaturated CC double bonds. The resin composition may be used to fabricate different articles and may be used in a printed circuit board hole-plugging process or a printed circuit board circuit filling process. The resin composition or the article made therefrom may achieve improvements in one or more properties including varnish shelf life, percent of organic volatile matters, dissipation factor, glass transition temperature, percent of thermal expansion in Z-axis, copper foil peeling strength, water absorption ratio and percent of cure shrinkage.
Crosslinkable polymer composition, crosslinked polymer material, metal member, and wiring harness
A crosslinkable polymer composition and a crosslinked polymer material including a metal member and a wiring harness. The crosslinkable polymer composition contains component A from which metal ion is released by heat, component B containing an organic polymer having a substituent capable of ionic bonding with the metal ion released from component A, and component C containing one or more acidic phosphate ester with a carbon number of 4 to 30. Assuming that the metal ion released from component A has a valence of +y and a content of the metal ion is m mol, the substituent contained in component B has a valence of z and a content of the substituent is n mol, the acidic phosphate constituting component C has a valence of x and a content of the acidic phosphate esters is 1 mol
g0.1 holds for g=(m.Math.yl.Math.x)/(n.Math.z).
Crosslinkable polymer composition, crosslinked polymer material, metal member, and wiring harness
A crosslinkable polymer composition and a crosslinked polymer material including a metal member and a wiring harness. The crosslinkable polymer composition contains component A from which metal ion is released by heat, component B containing an organic polymer having a substituent capable of ionic bonding with the metal ion released from component A, and component C containing one or more acidic phosphate ester with a carbon number of 4 to 30. Assuming that the metal ion released from component A has a valence of +y and a content of the metal ion is m mol, the substituent contained in component B has a valence of z and a content of the substituent is n mol, the acidic phosphate constituting component C has a valence of x and a content of the acidic phosphate esters is 1 mol
g0.1 holds for g=(m.Math.yl.Math.x)/(n.Math.z).
BINDER COMPOSITION, NEGATIVE ELECTRODE INCLUDING BINDER COMPOSED OF THE COMPOSITION, METHOD FOR MANUFACTURING THE NEGATIVE ELECTRODE, AND ALL-SOLID-STATE BATTERY INCLUDING THE NEGATIVE ELECTRODE
Disclosed are a binder composition that may exhibit superior binding ability when being contained in a negative electrode, a negative electrode including a binder composed of the composition, a method for manufacturing the negative electrode, and an all-solid-state battery including the negative electrode that may exhibit superior cycle life characteristics. The binder composition includes a polymer including a reactive diene, an acrylate-based compound, and a photo-crosslink initiator. A ratio between a total number of moles of double bonds in the polymer and a total number of moles of double bonds in the acrylate-based compound is in a range of 6:4 inclusive to 9:1 inclusive.
BINDER COMPOSITION, NEGATIVE ELECTRODE INCLUDING BINDER COMPOSED OF THE COMPOSITION, METHOD FOR MANUFACTURING THE NEGATIVE ELECTRODE, AND ALL-SOLID-STATE BATTERY INCLUDING THE NEGATIVE ELECTRODE
Disclosed are a binder composition that may exhibit superior binding ability when being contained in a negative electrode, a negative electrode including a binder composed of the composition, a method for manufacturing the negative electrode, and an all-solid-state battery including the negative electrode that may exhibit superior cycle life characteristics. The binder composition includes a polymer including a reactive diene, an acrylate-based compound, and a photo-crosslink initiator. A ratio between a total number of moles of double bonds in the polymer and a total number of moles of double bonds in the acrylate-based compound is in a range of 6:4 inclusive to 9:1 inclusive.
RESIN COMPOSITION, ARTICLE MADE THEREFROM, AND USE THEREOF
The present disclosure provides a resin composition, including: a component (A): 100 parts by weight of an unhydrogenated maleic anhydride-modified first polyolefin; a component (B): 20 to 100 parts by weight of an acrylate monomer, its oligomer or combination thereof, the acrylate monomer has at least two unsaturated carbon-carbon double bonds; and a component (C): 5 to 160 parts by weight of a benzocyclobutene-modified second polyolefin. In addition, the present disclosure also provides an article made from the resin composition. The resin composition and the product have improvements in one or more properties including solder floating crack rate, copper foil peeling strength, percent of thermal expansion at Z-axis, water absorption ratio, and dissipation factor. The present disclosure also provides a use of the resin composition in the resin filling process of printed circuit boards.