The specific embodiment of the present disclosure provides a protective coating. An anticorrosive coating having a compact rigid molecular structure is formed by plasma polymerization coating of monomers including alicyclic epoxy structural units, and a hydrophobic coating is simultaneously formed by plasma polymerization coating on the anticorrosive coating, thus, coatings with excellent protective performance to the substrate are formed.

The present disclosure relates to agents, compositions, and methods for inhibiting corrosion in various substrates, for example in metal substrates. The present disclosure also relates to compositions for inhibiting corrosion comprising at least one organic heterocyclic compound and at least one metal salt or mixed metal salt selected from rare earth, alkali earth and transition metals.

The present disclosure relates to agents, compositions, and methods for inhibiting corrosion in various substrates, for example in metal substrates. The present disclosure also relates to compositions for inhibiting corrosion comprising at least one organic heterocyclic compound and at least one metal salt or mixed metal salt selected from rare earth, alkali earth and transition metals.

The present disclosure relates to agents, compositions, and methods for inhibiting corrosion in various substrates, for example in metal substrates. The present disclosure also relates to compositions for inhibiting corrosion comprising at least one organic heterocyclic compound and at least one metal salt or mixed metal salt selected from rare earth, alkali earth and transition metals.

A coating system including at least one reactive resin system RH, at least one thixotropic assistant TH selected from the group consisting of urea preparations HZ and fibers FS and at least one inorganic aggregate AZ having a particle size in the range from 0.2 to 3.0 mm. The coating system has a viscosity as measured with a shear rate of 1 s.sup.−1 of 9000-100,000 Pas and a viscosity as measured with a shear rate of 100 s.sup.−1 of 400-15,000 Pas. The coating system is notable for high surface roughness and for reliable and long-term bonding of the aggregates to the coating with no need for sealing. There is also no need for the coating to be subsequently strewn with aggregates such as sand, for example.

A coating system including at least one reactive resin system RH, at least one thixotropic assistant TH selected from the group consisting of urea preparations HZ and fibers FS and at least one inorganic aggregate AZ having a particle size in the range from 0.2 to 3.0 mm. The coating system has a viscosity as measured with a shear rate of 1 s.sup.−1 of 9000-100,000 Pas and a viscosity as measured with a shear rate of 100 s.sup.−1 of 400-15,000 Pas. The coating system is notable for high surface roughness and for reliable and long-term bonding of the aggregates to the coating with no need for sealing. There is also no need for the coating to be subsequently strewn with aggregates such as sand, for example.

A method to prevent corrosion of a susceptible article of a two-article system, in which first and second articles of the two-article system have surfaces facing one another and in which the two articles have different anodic indices includes applying a coating material to the surface of the first article and curing the coating material on the surface of the first article. The method further includes contacting and securing the surface of the first article with the surface of the second article. The two articles exhibit substantially no corrosion following exposure to a corrosive environment under standard GMW17026 for a 15 year simulated test.

A method to prevent corrosion of a susceptible article of a two-article system, in which first and second articles of the two-article system have surfaces facing one another and in which the two articles have different anodic indices includes applying a coating material to the surface of the first article and curing the coating material on the surface of the first article. The method further includes contacting and securing the surface of the first article with the surface of the second article. The two articles exhibit substantially no corrosion following exposure to a corrosive environment under standard GMW17026 for a 15 year simulated test.

The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.