Disclosed is an inorganic binder made with silica sol-gel, and a method of manufacturing the inorganic binder. Techniques and systems are disclosed for using the inorganic binder in light conversion systems, including phosphor wheels. Phosphor wheels with the inorganic binder are capable of withstanding high temperatures, have a highlight transmittance, have a high tensile-shear strength, can be applied by a flexible coating process, and have a low curing temperatures.

Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 μm or more and 50 μm or less.

Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 μm or more and 50 μm or less.

Methods of forming a mirror by bonding a faceplate to a core structure using adhesive formulations that include: (1) a binder comprising 40 to 60 weight % monoaluminum phosphate and 40 to 60 weight % water, the binder constituting 25 to 35 weight % of the adhesive formulation and, (2) a composition that includes a first set of particles having a coefficient of thermal expansion equal to or less than 0.05 ppm/° C. and diameters between 1 to 60 micrometers and a second set of particles having a coefficient of thermal expansion equal to or less than 0.05 ppm/° C. and diameters between 0.05 to 1 micrometers, the first set of particles constituting 80 to 85 weight % of the composition, the second set of particles constituting 15 to 20 weight % of the composition; the composition constituting 65 to 75 weigh % of the adhesive formulation.

The present invention relates to an alkali metal silicate coating formed from alkali metal silicate represented by the chemical formula M.sub.2O.nSiO.sub.2 and lithium silicate represented by the chemical formula Li.sub.2O.mSiO.sub.2, wherein M is selected from sodium, potassium, or a mixture thereof, n is from 2.9 to 3.7, m is from 4.2 to 4.8, and the molar ratio of M.sub.2O.nSiO.sub.2 to Li.sub.2O.mSiO.sub.2 is from 2.2 to 4.8; wherein the alkali metal silicate coating has a thickness of from 630 to 1,450 mg/m.sup.2, preferably from 700 to 1,400 mg/m.sup.2, in terms of SiO.sub.2 as measured by fluorescent X-ray spectrometry. The present invention further relates to a preparation method of the coating. The coating of the present invention has excellent heat resistance, hot water resistance and stain resistance, as well as excellent damage resistance.

The present invention provides novel silver particles that when used as a conductive adhesive, are satisfactorily sintered at a low temperature without application of pressure during sintering of the conductive adhesive, and form a sintered body with high denseness and high mechanical strength (shear strength). Silver particles comprising silver particles A with an average particle diameter in the range of 50 to 500 nm, and silver particles B with an average particle diameter in the range of 0.5 to 5.5 μm, wherein the silver particles satisfy a relationship in which the average particle diameter of the silver particles B is 5 to 11 times the average particle diameter of the silver particles A.

An object of the present disclosure is to provide a paste that can suppress fluctuations in viscosity at a printing temperature to perform printing without unevenness, and is sintered fast even in an inert gas atmosphere such as nitrogen to form a highly accurate conductive wiring and a joined structure excellent in joining strength. The present disclosure provides an adhesive conductive paste for forming a conductive wiring and/or a joined structure to connect electronic elements, the adhesive conductive paste including a conductive particle and a solvent. The adhesive conductive paste contains, as the conductive particle, a silver particle (A) having an average particle size of 1 nm or greater and less than 100 nm and a silver particle (B) having an average particle size of 0.1 μm or greater and 10 μm or less, the silver particle (A) being a silver nanoparticle having a configuration in which a surface is coated with a protective agent containing amine, and the adhesive conductive paste contains, as the solvent, a compound (C) represented by Formula (I) below:

R.sup.a—O—(X—O).sub.n—R.sup.b  (I) where in Formula (I), R.sup.a represents a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, X represents a divalent group selected from a hydrocarbon group having from 2 to 6 carbon atoms, R.sup.b represents a hydrogen atom or a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, R.sup.a and R.sup.b may be the same, n represents an integer from 1 to 3.

An object of the present disclosure is to provide a paste that can suppress fluctuations in viscosity at a printing temperature to perform printing without unevenness, and is sintered fast even in an inert gas atmosphere such as nitrogen to form a highly accurate conductive wiring and a joined structure excellent in joining strength. The present disclosure provides an adhesive conductive paste for forming a conductive wiring and/or a joined structure to connect electronic elements, the adhesive conductive paste including a conductive particle and a solvent. The adhesive conductive paste contains, as the conductive particle, a silver particle (A) having an average particle size of 1 nm or greater and less than 100 nm and a silver particle (B) having an average particle size of 0.1 μm or greater and 10 μm or less, the silver particle (A) being a silver nanoparticle having a configuration in which a surface is coated with a protective agent containing amine, and the adhesive conductive paste contains, as the solvent, a compound (C) represented by Formula (I) below:

R.sup.a—O—(X—O).sub.n—R.sup.b  (I) where in Formula (I), R.sup.a represents a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, X represents a divalent group selected from a hydrocarbon group having from 2 to 6 carbon atoms, R.sup.b represents a hydrogen atom or a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, R.sup.a and R.sup.b may be the same, n represents an integer from 1 to 3.

Disclosed is a fluorescent plate in which a high reflectance of a reflective layer can be maintained over a long period of time, and occurrence of peeling of the reflective layer can be suppressed. The fluorescent plate of the present invention includes a fluorescent material layer containing a fluorescent material, an oxide layer disposed below the fluorescent material layer, and a reflective layer which is disposed below the oxide layer and is formed of silver, and further includes an oxidation-preventive protective layer which is disposed between the oxide layer and the reflective layer and is formed of a translucent material, and a translucent adhesion layer interposed between the oxidation-preventive protective layer and the reflective layer.

An assembly for fixing an optical element in a manner that decouples the optical element from mechanical stresses and thermal strains while providing freedom to facilitate alignment of the optical element, and while also eliminating polymers that can cause contamination problems including a mount configured for attachment to an optical system; a plurality of flexible metal members, each flexible member having a first end affixed to or integrally extending from the mount, and a free end defining a bearing surface for supporting an optical element; and an inorganic adhesive joining a surface of the optical member to the bearing surface.