Patent classifications
C09J1/00
HEAT BONDING OF LOW ENERGY SURFACE SUBSTRATES
A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.
HEAT BONDING OF LOW ENERGY SURFACE SUBSTRATES
A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.
FILM-SHAPED FIRING MATERIAL, FILM-SHAPED FIRING MATERIAL PROVIDED WITH SUPPORT SHEET, METHOD FOR MANUFACTURING FILM-SHAPED FIRING MATERIAL, AND METHOD FOR MANUFACTURING FILM-SHAPED FIRING MATERIAL PROVIDED WITH SUPPORT SHEET
This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.
FILM-SHAPED FIRING MATERIAL, FILM-SHAPED FIRING MATERIAL PROVIDED WITH SUPPORT SHEET, METHOD FOR MANUFACTURING FILM-SHAPED FIRING MATERIAL, AND METHOD FOR MANUFACTURING FILM-SHAPED FIRING MATERIAL PROVIDED WITH SUPPORT SHEET
This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.
Fluorescent glue for LED lighting bar and LED bulb lamp using the LED lighting bar
Disclosed is a fluorescent glue for an LED lighting bar, and an LED bulb lamp, the fluorescent glue comprises a phosphor, a heat radiation material having a refractive index larger than 1.4 and a heat emissivity larger than 0.8, and a colloid, the heat radiation material accounts for 0.5% to 10% by weight of the fluorescent glue, the phosphor accounts for 25% to 45% by weight of the fluorescent glue, and the colloid accounts for 45% to 74.5% by weight of the fluorescent glue. The fluorescent glue combined with the heat radiation material can directly convert heat generated by an LED chip and the fluorescent glue into infrared waves that are radiated into the surrounding environment, without additionally providing a heat dissipating device or spraying a heat dissipating coating.
Fluorescent glue for LED lighting bar and LED bulb lamp using the LED lighting bar
Disclosed is a fluorescent glue for an LED lighting bar, and an LED bulb lamp, the fluorescent glue comprises a phosphor, a heat radiation material having a refractive index larger than 1.4 and a heat emissivity larger than 0.8, and a colloid, the heat radiation material accounts for 0.5% to 10% by weight of the fluorescent glue, the phosphor accounts for 25% to 45% by weight of the fluorescent glue, and the colloid accounts for 45% to 74.5% by weight of the fluorescent glue. The fluorescent glue combined with the heat radiation material can directly convert heat generated by an LED chip and the fluorescent glue into infrared waves that are radiated into the surrounding environment, without additionally providing a heat dissipating device or spraying a heat dissipating coating.
Golf shaft
Provided is a golf shaft comprising an element tube made of steel, a plating layer formed on an outer periphery of the element tube, an outer layer covering the plating layer, an adhesive layer interposed between the plating layer and the outer layer to bond between the plating layer and the outer layer. The outer layer is formed of a fiber reinforced plastic having a matrix resin that is an epoxy resin, and the adhesive layer is an epoxy resin composition or a carbon nano tube resin composition, the epoxy resin composition comprising an epoxy resin and a mixed curing agent in which two or more kinds of amine-based curing agents are mixed, and the carbon nano tube resin composition comprising an epoxy resin and at least one kind of curing agents as well as dispersed carbon nano tubes.
Golf shaft
Provided is a golf shaft comprising an element tube made of steel, a plating layer formed on an outer periphery of the element tube, an outer layer covering the plating layer, an adhesive layer interposed between the plating layer and the outer layer to bond between the plating layer and the outer layer. The outer layer is formed of a fiber reinforced plastic having a matrix resin that is an epoxy resin, and the adhesive layer is an epoxy resin composition or a carbon nano tube resin composition, the epoxy resin composition comprising an epoxy resin and a mixed curing agent in which two or more kinds of amine-based curing agents are mixed, and the carbon nano tube resin composition comprising an epoxy resin and at least one kind of curing agents as well as dispersed carbon nano tubes.
Glass panel unit and glass window
A glass panel unit including a first panel including at least a first glass plate; a second panel arranged to face the first panel and including at least a second glass plate; a frame member formed in a shape of a frame, corresponding in shape to respective peripheral portions of the first panel and the second panel extending along edges thereof, and bonded to the peripheral portions; and at least one spacer provided in a vacuum space between the first panel and the second panel. The at least one spacer containing a polyimide, where the polyimide has an absorption edge at which an absorption index decreases in an optical absorption spectrum ranging from an ultraviolet ray to visible radiation, the absorption edge being equal to or less than 400 nm, and the polyimide includes at least one selected from the group consisting of a fluorine group and a chlorine group.
Glass panel unit and glass window
A glass panel unit including a first panel including at least a first glass plate; a second panel arranged to face the first panel and including at least a second glass plate; a frame member formed in a shape of a frame, corresponding in shape to respective peripheral portions of the first panel and the second panel extending along edges thereof, and bonded to the peripheral portions; and at least one spacer provided in a vacuum space between the first panel and the second panel. The at least one spacer containing a polyimide, where the polyimide has an absorption edge at which an absorption index decreases in an optical absorption spectrum ranging from an ultraviolet ray to visible radiation, the absorption edge being equal to or less than 400 nm, and the polyimide includes at least one selected from the group consisting of a fluorine group and a chlorine group.