Disclosed pressure sensitive adhesive compositions, having enhanced heat resistance, obtained by the emulsion polymerization of (a) one or more acrylic acid ester or (meth)acrylate acid ester(s), (b) one or more hydroxyl functional (meth)acrylic monomer and (c) one or more ureido substituted (meth)acrylate monomers(s).

An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.

An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.

The present invention aims to provide an adhesive composition that is easily separable by irradiation with light even after high-temperature processing at 300° C. or higher with an adherend fixed thereon, an adhesive tape including an adhesive layer formed of the adhesive composition, and a method for processing an electronic component. The present invention is an adhesive composition including: a reactive resin having an imide backbone and containing a double bond-containing functional group in a side chain or at an end; and a silicone compound or a fluorine compound.

Disclosed herein are adhesive compositions containing a polythiol compound, a (meth)acrylate monomer and/or a (meth)acrylate oligomer, a photoinitiator, and a stabilizer. These thiol-based adhesive compositions have a viscosity in the 5-100 cP range, and can be used to repair chips, cracks, and other damaged areas of a glass or automobile windshield.

Disclosed herein are adhesive compositions containing a polythiol compound, a (meth)acrylate monomer and/or a (meth)acrylate oligomer, a photoinitiator, and a stabilizer. These thiol-based adhesive compositions have a viscosity in the 5-100 cP range, and can be used to repair chips, cracks, and other damaged areas of a glass or automobile windshield.

The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants. The cure accelerators may be embraced generally within the structure below

##STR00001##

where X is CH.sub.2, O, S, NR′, CR″R′″ or C═O; R is hydrogen or (meth)acryl; R.sup.6 is hydrogen, halogen, amino, carboxyl, nitro, alkyl, alkenyl, alkynyl, hydroxyalkyl, hydroxyalkenyl, hydroxyalkynyl, or alkaryl; and A and A.sup.1 are each individually selected from hydrogen or taken together create a ring structure of 5 to 12 total ring atoms, wherein the ring structure may be cycloaliphatic, cycloheteroaliphatic or aromatic or combinations thereof with or without substitution by one or more hydroxyl or (meth)acryl groups; and n is 0 or 1, provided that when R is hydrogen, A and A′ cannot both be hydrogen or taken together cannot be naphthyl.

The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants. The cure accelerators may be embraced generally within the structure below

##STR00001##

where X is CH.sub.2, O, S, NR′, CR″R′″ or C═O; R is hydrogen or (meth)acryl; R.sup.6 is hydrogen, halogen, amino, carboxyl, nitro, alkyl, alkenyl, alkynyl, hydroxyalkyl, hydroxyalkenyl, hydroxyalkynyl, or alkaryl; and A and A.sup.1 are each individually selected from hydrogen or taken together create a ring structure of 5 to 12 total ring atoms, wherein the ring structure may be cycloaliphatic, cycloheteroaliphatic or aromatic or combinations thereof with or without substitution by one or more hydroxyl or (meth)acryl groups; and n is 0 or 1, provided that when R is hydrogen, A and A′ cannot both be hydrogen or taken together cannot be naphthyl.

The present invention is to provide a monomer mixture that is cured rapidly even in the presence of oxygen and that forms a cured product having high hardness and excellent adhesion to metals and/or glass. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. As the cationically polymerizable monomers, the monomer mixture contains at least 10 wt. %, based on a total amount of the monomer mixture, of a compound having at least one cationically polymerizable group selected from the group consisting of a vinyl ether group, an epoxy group, and an oxetanyl group, and at least one hydroxy group in a molecule, and at least 5 wt. %, based on the total amount of the monomer mixture, of a compound represented by Formula (b). In the formula, R represents an s-valent straight-chain or branched saturated aliphatic hydrocarbon group or an s-valent group having two or more straight-chain or branched saturated aliphatic hydrocarbon groups bonded to each other through an ether bond, and s represents an integer of 2 or greater.

The present invention is to provide a monomer mixture that is cured rapidly even in the presence of oxygen and that forms a cured product having high hardness and excellent adhesion to metals and/or glass. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. As the cationically polymerizable monomers, the monomer mixture contains at least 10 wt. %, based on a total amount of the monomer mixture, of a compound having at least one cationically polymerizable group selected from the group consisting of a vinyl ether group, an epoxy group, and an oxetanyl group, and at least one hydroxy group in a molecule, and at least 5 wt. %, based on the total amount of the monomer mixture, of a compound represented by Formula (b). In the formula, R represents an s-valent straight-chain or branched saturated aliphatic hydrocarbon group or an s-valent group having two or more straight-chain or branched saturated aliphatic hydrocarbon groups bonded to each other through an ether bond, and s represents an integer of 2 or greater.