A dispersion composition comprising a filler, a polymerizable monomer or oligomer, and an additive comprising a polycyclic aromatic group. The dispersion composition may be used for making a polymer film used as an electrode, a conductive layer, a sealing layer, a polymer part, and an adhesive film of a device.

A dispersion composition comprising a filler, a polymerizable monomer or oligomer, and an additive comprising a polycyclic aromatic group. The dispersion composition may be used for making a polymer film used as an electrode, a conductive layer, a sealing layer, a polymer part, and an adhesive film of a device.

A dispersion composition comprising a filler, a polymerizable monomer or oligomer, and an additive comprising a polycyclic aromatic group. The dispersion composition may be used for making a polymer film used as an electrode, a conductive layer, a sealing layer, a polymer part, and an adhesive film of a device.

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

A curable composition, including a 2-cyanoacrylate compound represented by Formula (1), in which a storage modulus of a cured product of the curable composition at 23° C. is from 1.0×10.sup.4 Pa to 1.0×10.sup.8 Pa and in which, in Formula (1), each L.sup.1 independently represents a linear or branched alkylene group having 2 to 6 carbon atoms which may have a sub stituent, p represents an integer from 2 to 8, and R.sup.1 represents an linear or branched alkyl group, an aryl group, an alkenyl group or an alkynyl group having 1 to 8 carbon atoms which may have a substituent.

##STR00001##

A curable composition, including a 2-cyanoacrylate compound represented by Formula (1), in which a storage modulus of a cured product of the curable composition at 23° C. is from 1.0×10.sup.4 Pa to 1.0×10.sup.8 Pa and in which, in Formula (1), each L.sup.1 independently represents a linear or branched alkylene group having 2 to 6 carbon atoms which may have a sub stituent, p represents an integer from 2 to 8, and R.sup.1 represents an linear or branched alkyl group, an aryl group, an alkenyl group or an alkynyl group having 1 to 8 carbon atoms which may have a substituent.

##STR00001##

A polymerizable composition; a product of polymerization of the polymerizable composition; and various molded articles obtained using the polymerizable composition and the product of polymerization of the polymerizable composition. The polymerizable composition contains N-substituted (meth)acrylamide (A) represented by a the formula:

##STR00001##

where R.sup.1 represents a hydrogen atom or a methyl group, one of R.sup.2 and R.sup.3 represents a chain hydrocarbon group having 6 or more carbon atoms or a cyclic hydrocarbon group having 6 or more carbon atoms, the other represents a hydrogen atom, a chain hydrocarbon group having 1 or more carbon atoms, or a cyclic hydrocarbon group having 3 or more carbon atoms, and R.sup.2 and R.sup.3 include a group in which a 6- or more-membered saturated ring is formed together with a nitrogen atom carrying R.sup.2 and R.sup.3.

A polymerizable composition; a product of polymerization of the polymerizable composition; and various molded articles obtained using the polymerizable composition and the product of polymerization of the polymerizable composition. The polymerizable composition contains N-substituted (meth)acrylamide (A) represented by a the formula:

##STR00001##

where R.sup.1 represents a hydrogen atom or a methyl group, one of R.sup.2 and R.sup.3 represents a chain hydrocarbon group having 6 or more carbon atoms or a cyclic hydrocarbon group having 6 or more carbon atoms, the other represents a hydrogen atom, a chain hydrocarbon group having 1 or more carbon atoms, or a cyclic hydrocarbon group having 3 or more carbon atoms, and R.sup.2 and R.sup.3 include a group in which a 6- or more-membered saturated ring is formed together with a nitrogen atom carrying R.sup.2 and R.sup.3.

The adhesive composition includes: a cyclic organosilazane compound of the following general formula (1):

##STR00001##

wherein R.sup.1s each independently represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and p represents an integer of 3 to 8; and a hydrolyzable group-containing organosilicon compound containing an alkoxysilane

compound of the following general formula (2) and/or a partial hydrolytic condensate thereof:

R.sup.2.sub.x—Si(OR.sup.3).sub.4-x   (2)

wherein R.sup.2 represents an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms and optionally having an oxygen atom, R.sup.3 represents an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and x represents an integer of 0 to 2.