An object of the present invention is to provide an adhesive composition having excellent adhesiveness and crack resistance. The present invention relates to a conductive adhesive composition comprising (a) a (meth)acrylic acid ester monomer, (b) a tackifier, (c) bismaleimide, and (d) a radical initiator, wherein a homopolymer of the (meth)acrylic acid ester monomer (a) has a glass transition temperature (T.sub.g) of 50° C. or lower, and the tackifier (b) has a Hazen unit colour number of 300 or less.

An object of the present invention is to provide an adhesive composition having excellent adhesiveness and crack resistance. The present invention relates to a conductive adhesive composition comprising (a) a (meth)acrylic acid ester monomer, (b) a tackifier, (c) bismaleimide, and (d) a radical initiator, wherein a homopolymer of the (meth)acrylic acid ester monomer (a) has a glass transition temperature (T.sub.g) of 50° C. or lower, and the tackifier (b) has a Hazen unit colour number of 300 or less.

An adhesive coating composition according to an embodiment of the present invention comprises polyethylene acrylate including a repeating unit represented by chemical formula 1 below and a repeating unit represented by chemical formula 2 below, wherein the polyethylene acrylate includes 65-90 wt % of the repeating unit represented by chemical formula 1 below and 10-35 wt % of the repeating unit represented by chemical formula 2 below.

An adhesive coating composition according to an embodiment of the present invention comprises polyethylene acrylate including a repeating unit represented by chemical formula 1 below and a repeating unit represented by chemical formula 2 below, wherein the polyethylene acrylate includes 65-90 wt % of the repeating unit represented by chemical formula 1 below and 10-35 wt % of the repeating unit represented by chemical formula 2 below.

An acrylic conductive paste is provided, based on 100 parts by weight, including: 30-84 parts of conductive particles, 15˜45 parts of acrylate, 0.5˜2.5 parts of adhesion promoter, 0.5˜3 parts of initiator. The conductive particles include three-dimensional dendritic conductive particles; and the adhesion promoter is a mixture of a silane coupling agent and a phosphate ester. The conductive paste of the present disclosure has good electrical conductivity, short curing time, strong adhesion, and can be used for a long-time room temperature operation. The present disclosure also provides a method for preparing the above-mentioned acrylic conductive paste, which is convenient for operation and industrial application; at the same time, it shows that the acrylic conductive paste of the present disclosure can be applied to semiconductor components for packaging a semiconductor device.

An epoxy conductive paste is disclosed, based on 100 parts by total mass, comprising the following raw material components: 30˜81 parts of conductive particles, 16˜30 parts of epoxy, 0.2˜3 parts of acrylic, 1˜15 parts of reactive diluent, 1˜15 parts of toughening agent, 0.4˜5 parts of silane coupling agent, and 0.4˜5 parts of cationic curing agent; wherein, the conductive particles include conductive particles with a three-dimensional dendritic microstructure. The conductive paste of the disclosure has the characteristics of good conductivity, short curing time, strong adhesion, and capability for long-term operation at room temperature.

The present disclosure relates to a method of coating a non-conductive substrate, said method comprising the steps of: a) applying a coating composition to the substrate, wherein the coating composition comprises: i) at least one unsaturated compound, ii) a thermal initiator comprising an organic peroxide, iii) a photoinitiator, and iv) at least one pigment, wherein the coating composition is free of accelerator, is capable of decreasing the activation energy of the thermal initiator, and is free of Co compounds, b) exposing the coating composition to UV light effective to start polymerization of the unsaturated compound, and c) exposing the coating composition to microwave heating effective to decompose the thermal initiator, wherein step c) is performed either simultaneously with step b) or sequentially after step b).

The present disclosure relates to a method of coating a non-conductive substrate, said method comprising the steps of: a) applying a coating composition to the substrate, wherein the coating composition comprises: i) at least one unsaturated compound, ii) a thermal initiator comprising an organic peroxide, iii) a photoinitiator, and iv) at least one pigment, wherein the coating composition is free of accelerator, is capable of decreasing the activation energy of the thermal initiator, and is free of Co compounds, b) exposing the coating composition to UV light effective to start polymerization of the unsaturated compound, and c) exposing the coating composition to microwave heating effective to decompose the thermal initiator, wherein step c) is performed either simultaneously with step b) or sequentially after step b).

A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.

A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.