C09J5/00

SEALING METHOD
20230037303 · 2023-02-09 · ·

Provided is a sealing method that uses a photo-curable sealant sheet. The sealing method provided comprises, in the following order, a step of obtaining a photo-curable sealant sheet, a step of subj ecting the sealant sheet to photoirradiation, and a step of applying the sealant sheet to a target object.

METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND METHOD OF SEPARATING SUBSTRATE
20230040281 · 2023-02-09 ·

Disclosed are methods of fabricating semiconductor devices and methods of separating substrates. The semiconductor device fabricating method comprises providing a release layer between a carrier substrate and a first surface of a device substrate to attach the device substrate to the carrier substrate, irradiating the carrier substrate with an ultraviolet ray to separate the carrier substrate from the release layer and to expose one surface of the release layer, and performing a cleaning process on the one surface of the release layer to expose the first surface of the device substrate. The release layer includes an aromatic polymerization unit and a siloxane polymerization unit.

Organopolysiloxane composition, and half-cured product and cured product produced from same
11555120 · 2023-01-17 · ·

Provided is a hydrosilylation reactive composition that has a sufficient pot life at room temperature, that can be cured at low temperature by exposure to high energy radiation, and that produces a stable semi-cured product during the curing process, and to provide a semi-cured product and a cured product obtained using this hydrosilylation reactive composition. The composition comprises: (A) a compound containing at least one aliphatically unsaturated monovalent hydrocarbon group in the molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms in the molecule; (C) a first hydrosilylation catalyst exhibiting activity in the composition without exposure to high energy radiation; and (D) a second hydrosilylation catalyst not exhibiting activity unless exposed to high energy radiation, and exhibiting activity in the composition by exposure to high energy radiation.

Cyanoacrylate compositions

Cyanoacrylate compositions, methods for forming same, and applications thereof are disclosed. The compositions demonstrate improved thermal ageing performance, including improved tensile strength performance after heat ageing in high humidity.

Cyanoacrylate compositions

Cyanoacrylate compositions, methods for forming same, and applications thereof are disclosed. The compositions demonstrate improved thermal ageing performance, including improved tensile strength performance after heat ageing in high humidity.

Anisotropic conductive film

An anisotropic conductive film can reduce the conduction resistance of an anisotropic conductively connected connection structure, and can reliably suppress the occurrence of short-circuits. The film has a structure wherein insulating particle-including conductive particles, wherein insulating particles adhere to the surfaces of conductive particles, are distributed throughout an insulating resin layer. In the insulating particle-including conductive particles, a number of insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than with respect to a film planar direction. Preferably, a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.

Anisotropic conductive film

An anisotropic conductive film can reduce the conduction resistance of an anisotropic conductively connected connection structure, and can reliably suppress the occurrence of short-circuits. The film has a structure wherein insulating particle-including conductive particles, wherein insulating particles adhere to the surfaces of conductive particles, are distributed throughout an insulating resin layer. In the insulating particle-including conductive particles, a number of insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than with respect to a film planar direction. Preferably, a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.

Method for producing multilayer member
11554554 · 2023-01-17 · ·

A method for producing a multilayer member having a first member containing a crystallizable thermoplastic resin, an adhesion layer, and a second member includes performing a dry treatment on a surface of the first member containing a crystallizable thermoplastic resin so as to satisfy conditions A and B, applying an adhesive to the surface of the first member to form an adhesive layer on the surface, and adhering the second member to the adhesive layer. (A) The ultimate temperature of the first member is lower than the peak temperature of endothermic peak obtained by DSC of the crystallizable thermoplastic resin. (B) The high temperature holding time of the first member is less than 3.0 seconds, which is when the first member is continuously held at a temperature not lower than a temperature at the starting point of the endothermic peak obtained by DSC of the crystallizable thermoplastic resin.

Method for producing multilayer member
11554554 · 2023-01-17 · ·

A method for producing a multilayer member having a first member containing a crystallizable thermoplastic resin, an adhesion layer, and a second member includes performing a dry treatment on a surface of the first member containing a crystallizable thermoplastic resin so as to satisfy conditions A and B, applying an adhesive to the surface of the first member to form an adhesive layer on the surface, and adhering the second member to the adhesive layer. (A) The ultimate temperature of the first member is lower than the peak temperature of endothermic peak obtained by DSC of the crystallizable thermoplastic resin. (B) The high temperature holding time of the first member is less than 3.0 seconds, which is when the first member is continuously held at a temperature not lower than a temperature at the starting point of the endothermic peak obtained by DSC of the crystallizable thermoplastic resin.

Method for producing an object from a precursor, and use of a radically crosslinkable resin in an additive production method

A process for producing an object from a precursor comprises the steps of: I) depositing a free-radically crosslinked resin atop a carrier to obtain a ply of a construction material joined to the carrier which corresponds to a first selected cross section of the precursor; II) depositing a free-radically crosslinked resin atop a previously applied ply of the construction material to obtain a further ply of the construction material which corresponds to a further selected cross section of the precursor and which is joined to the previously applied ply; III) repeating step II) until the precursor is formed; IV) treating the precursor obtained after step III) under conditions sufficient to at least partially trimerize to isocyanurate groups NCO groups present in the free-radically crosslinked resin of the obtained precursor to obtain the object.