The present invention relates to an optical adhesive film which has excellent adhesive strength at room temperature and has improved efficiency in a rework process since peel strength is low at high temperatures. When attaching a touchscreen panel and an LCD by using the adhesive film of the present invention and separating the touchscreen panel and the LCD at high temperatures, the touchscreen panel and the LCD can be separated from each other without causing damage thereto. Additionally, the optical film of the present invention comprises two adhesive layers, wherein peeling occurs at the first adhesive layer having an adhesive composition such that a peeling surface can be controlled according to the convenience of a user.

An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4: ##STR00001##

The present disclosure relates to gripping surfaces and devices comprising the same, wherein the gripping surface comprises a shape tunable surface microstructure, wherein the height, width and spatial periodicity of the microstructures corresponds to an integer multiple of Schallamach wave amplitudes and wavelengths of a target surface, wherein the device microstructures and induced Schallamach waves are entrained by applying strain to the device.

The present disclosure relates to gripping surfaces and devices comprising the same, wherein the gripping surface comprises a shape tunable surface microstructure, wherein the height, width and spatial periodicity of the microstructures corresponds to an integer multiple of Schallamach wave amplitudes and wavelengths of a target surface, wherein the device microstructures and induced Schallamach waves are entrained by applying strain to the device.

Disclosed herein is an adhesive film which includes: a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles, wherein the nanoparticles include a silicone polymer and have an average particle diameter of about 5 nm to about 800 nm.

An adhesive strip including a support, a substrate and a plurality of fixing elements protruding from the substrate. The fixing elements and substrate are formed from a photo-curable adhesive composition that includes component A: a (meth)acrylate monomer or oligomer having at least two (meth)acrylate groups and having an average molecular weight M.sub.w from 700 g/mol to 7000 g/mol; component B: a (meth)acrylate monomer or oligomer having at least two (meth)acrylate groups and having an average molecular weight M.sub.w equal or greater than 150 g/mol and less than 700 g/mol; component C: a photoinitiator; and component D: a polythiol. A reclosable fastener can be formed with the adhesive strip such as a reclosable male-to-male adhesive based on a fastener having two adhesive strips.

A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

A system and method for manufacturing a strip or label used to place a substantially invisible identifying mark is disclosed. A strip is treated by removing at least one area of a liner element, a film layer and an adhesive layer. Each one of the removed areas is substantially congruent with the other removed areas. A laser or other ablating device is used to remove the areas through vaporization. The strip element is peeled away from the liner element, exposing the adhesive layer. The adhesive layer is thereafter pressed against a substantially flat metal surface. The laminate top coat and the film layer are removed from the object, leaving the adhesive layer in place. The adhesive material is impregnated with a UV sensitive material, but is otherwise invisible.

One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.