One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

The present invention provides an adhesive resin composition that is used for adhesion of a fluorine-based resin and is aimed at adhesion between fluorine-based resins or between a fluorine-based resin and a material other than a fluorine-based resin. More specifically, the present invention relates to an adhesive resin composition for use in adhesion of a fluorine-based resin, the composition including a polyethylene-based resin, an elastomer component, and a component having an epoxy group and a vinyl group, wherein a content of the polyethylene-based resin is 55 parts by mass or more and 90 parts by mass or less, a content of the elastomer component is 10 parts by mass or more and 45 parts by mass or less, the elastomer component and the component having an epoxy group and a vinyl group have a common repetition unit, and a content of the component having an epoxy group and a vinyl group based on a total amount of 100 parts by mass of the polyethylene-based resin and the elastomer component is 0.1 parts by mass or more and 1.5 parts by mass or less.

A method of producing a vehicle includes determining the performance of aged adhesive coupons, which are subject to a worst-case scenario of manufacturing, aging, and stress testing. Virtual vehicle components are modeled using the performance of the aged adhesive coupons. The virtual vehicle components are then subjected to virtual mechanical forces to determine their virtual performance, which is then validated against the performance of identical real-life aged vehicle components subjected to identical mechanical forces. A virtual vehicle is modeled using the validated virtual vehicle components. The virtual performance of the virtual vehicle when subject to a virtual crash test is then compared against a predetermined standard, and the design of the virtual vehicle is considered feasible if its performance exceeds the predetermined standard. A vehicle is manufactured according to the feasible design of the virtual vehicle.

A method of producing a vehicle includes determining the performance of aged adhesive coupons, which are subject to a worst-case scenario of manufacturing, aging, and stress testing. Virtual vehicle components are modeled using the performance of the aged adhesive coupons. The virtual vehicle components are then subjected to virtual mechanical forces to determine their virtual performance, which is then validated against the performance of identical real-life aged vehicle components subjected to identical mechanical forces. A virtual vehicle is modeled using the validated virtual vehicle components. The virtual performance of the virtual vehicle when subject to a virtual crash test is then compared against a predetermined standard, and the design of the virtual vehicle is considered feasible if its performance exceeds the predetermined standard. A vehicle is manufactured according to the feasible design of the virtual vehicle.

A thermosetting adhesive composition and thermosetting adhesive sheet capable of obtaining stable conductivity even in high-temperature environments or high-temperature/high-humidity environments are provided. The thermosetting adhesive sheet comprises an acrylic copolymer obtained by copolymerizing 55 to 80 wt % of alkyl (meth)acrylate, 15 to 30 wt % of acrylonitrile, and 5 to 15 wt % of glycidyl methacrylate; an epoxy resin; an epoxy resin curing agent; and a dendritic conductive filler having a tap density of 1.0 to 1.8 g/cm.sup.3. Thereby, thermal expansion after curing is suppressed, and electrical contacts of the conductive filler are increased, allowing stable conductivity to be obtained even in high-temperature environments or high-temperature/high-humidity environments.

The present invention relates to an adhesive resin composition including a styrene-ethylene-butylene-styrene copolymer with a specific chemical structure, an epoxy resin, an acid anhydride compound, and a curing catalyst, an adhesive film obtained from the resin composition, and a flexible metal laminate including the adhesive film.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.