The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.

An ultraviolet-curable (UV-curable) adhesive composition is disclosed. The adhesive composition comprises: A) an epoxy curing agent component; B) a microencapsulated epoxy resin component; C) an expansion agent component; D) a binder component; and E) a photoinitiator component. The adhesive composition is useful for forming an adhesive. In various embodiments, the adhesive composition is in the form of a stick. The adhesive composition is useful for securing a fastener (e.g. in a borehole).

A pressure-sensitive structural adhesive film based on an epoxy resin composition, wherein the epoxy resin composition comprises a latent-reactive, thermally activatable curing agent for producing a structural bond after thermal curing and additionally a curing agent that cross-links at room temperature, wherein the not-cured adhesive film is compressible and therefore allows for tolerance compensation.

A pressure-sensitive structural adhesive film based on an epoxy resin composition, wherein the epoxy resin composition comprises a latent-reactive, thermally activatable curing agent for producing a structural bond after thermal curing and additionally a curing agent that cross-links at room temperature, wherein the not-cured adhesive film is compressible and therefore allows for tolerance compensation.

Described are composite articles containing heat stable spun yarn containing textiles that exhibit low flammability and thermal shrinkage resistance. A composite article is described comprising (1) a textile layer comprising a heat stable spun yarn and (2) a heat reactive layer. The articles can be National Fire Protection Agency (“NFPA”) 2112 compliant.

Described are composite articles containing heat stable spun yarn containing textiles that exhibit low flammability and thermal shrinkage resistance. A composite article is described comprising (1) a textile layer comprising a heat stable spun yarn and (2) a heat reactive layer. The articles can be National Fire Protection Agency (“NFPA”) 2112 compliant.

Apparatuses, methods, and systems are disclosed for an adhesive including an activated portion and an unactivated portion. The adhesive is interposed between and binds the first substrate to a second substrate. The unactivated portion includes moisture, and the activated portion is activated to adhere in response to the removal of moisture. Similarly, the unactivated portion of the adhesive may be activated in response to the removal of moisture, removal of air, applying radiation, heating, and/or catalyzing a functional group.

The present invention discloses a dry powder composition comprising a thermosetting resin in particulate form, wherein the dry powder composition has a particle size measured according to ISO 13320 (2009) characterized by a D.sub.v90 of 50 μm or lower, a D.sub.v50 in the range of 5.1 to 12.5 μm, and a ratio of $\frac{\mathrm{Dv}90-\mathrm{Dv}10}{\mathrm{Dv}50}$
in the range of 1.5 to 4.2. The present invention also discloses processes for preparing the dry powder using jet milling, and processes of applying the dry powder composition to a metal surface. Furthermore, the present invention discloses the uses of the dry powder composition as a bonding material or as an adhesion promoter in a polymer compound.

The present invention discloses a dry powder composition comprising a thermosetting resin in particulate form, wherein the dry powder composition has a particle size measured according to ISO 13320 (2009) characterized by a D.sub.v90 of 50 μm or lower, a D.sub.v50 in the range of 5.1 to 12.5 μm, and a ratio of $\frac{\mathrm{Dv}90-\mathrm{Dv}10}{\mathrm{Dv}50}$
in the range of 1.5 to 4.2. The present invention also discloses processes for preparing the dry powder using jet milling, and processes of applying the dry powder composition to a metal surface. Furthermore, the present invention discloses the uses of the dry powder composition as a bonding material or as an adhesion promoter in a polymer compound.

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.