A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

An adhesive for heat press molding contains a reaction product obtained by heat treatment on a mixture containing a polycarboxylic acid and a saccharide.

The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.

The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.

A process for manufacturing pipes using thermoplastic pipe and “tape” (continuous fiber, fully wetted in a similar thermoplastic as the pipe) that embeds its fibers into pipe surface. The thermoplastic pipe is mechanically compressed prior fiber tape being applied. Outer diameter reduction of the pipe is at least partly maintained by the fiber tape being tightly wrapped around the pipe immediately after compression causes the pipe to contract. Then, an external heat source is applied to the pipe causing the thermoplastic to melt and the pipe to undergo thermal expansion. Fibers stretch less and are embedded into the molten layer of the pipe, creating a permanent bond between the fibers and the pipe. Individual pipes may be joined using couplers or butt welds.

A process for manufacturing pipes using thermoplastic pipe and “tape” (continuous fiber, fully wetted in a similar thermoplastic as the pipe) that embeds its fibers into pipe surface. The thermoplastic pipe is mechanically compressed prior fiber tape being applied. Outer diameter reduction of the pipe is at least partly maintained by the fiber tape being tightly wrapped around the pipe immediately after compression causes the pipe to contract. Then, an external heat source is applied to the pipe causing the thermoplastic to melt and the pipe to undergo thermal expansion. Fibers stretch less and are embedded into the molten layer of the pipe, creating a permanent bond between the fibers and the pipe. Individual pipes may be joined using couplers or butt welds.

This invention identifies important geometric parameters of an adhesive microfiber with mushroom-shaped tip for improving and optimizing adhesive ability. The magnitude of pull-off stress is dependent on a wedge angle γ and the ratio of the tip radius to the stalk radius β of the mushroom-shaped fiber. Pull-off stress is also found to depend on a dimensionless parameter x, the ratio of the fiber radius to a length-scale related to the dominance of adhesive stress. Finally, the shape of edge tip, where the surface and sides of the mushroom-shaped tip join, is a factor that impacts strength of adhesion. Optimizing ranges for these parameters are identified.

This invention identifies important geometric parameters of an adhesive microfiber with mushroom-shaped tip for improving and optimizing adhesive ability. The magnitude of pull-off stress is dependent on a wedge angle γ and the ratio of the tip radius to the stalk radius β of the mushroom-shaped fiber. Pull-off stress is also found to depend on a dimensionless parameter x, the ratio of the fiber radius to a length-scale related to the dominance of adhesive stress. Finally, the shape of edge tip, where the surface and sides of the mushroom-shaped tip join, is a factor that impacts strength of adhesion. Optimizing ranges for these parameters are identified.

Disclosed is a high-dielectric adhesive film, particularly a high-dielectric adhesive film including a substrate layer, a ceramic-mixed layer formed on one surface of the substrate layer and an adhesive layer formed on the surface of the substrate layer on which the ceramic-mixed layer is formed. The high-dielectric adhesive film thus configured is improved in permittivity due to the use of a ceramic component, thus preventing the malfunction of electronic devices, increasing the stability and performance thereof, and exhibiting heat dissipation effects.

Disclosed is a high-dielectric adhesive film, particularly a high-dielectric adhesive film including a substrate layer, a ceramic-mixed layer formed on one surface of the substrate layer and an adhesive layer formed on the surface of the substrate layer on which the ceramic-mixed layer is formed. The high-dielectric adhesive film thus configured is improved in permittivity due to the use of a ceramic component, thus preventing the malfunction of electronic devices, increasing the stability and performance thereof, and exhibiting heat dissipation effects.