Patent classifications
C09J11/00
Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
BODY FLUID RESISTANT TISSUE ADHESIVES
A tissue adhesive material that provides fast and robust adhesion even on tissue surfaces covered in bodily fluids. The tissue adhesive material is formed of a hydrophobic matrix and a plurality of bioadhesive microparticles dispersed within the hydrophobic matrix configured such that disposing the adhesive material directly on a fluid covered surface and applying pressure causes the (a) hydrophobic matrix to repel the fluid, (b) the bioadhesive particles to compress forming an adhesive layer, and (c) the bioadhesive particles to form temporary crosslinks followed by covalent crosslinks with the surface.
COMPOSITIONS INCORPORATING SILICA FIBERS
Embodiments of the invention include articles incorporating fibrous fragments of mats of silica fibers and methods for producing such articles. The fiber mats may be formed via electrospinning of a sol gel produced with a silicon alkoxide reagent, such as tetraethyl ortho silicate, alcohol solvent, and an acid catalyst.
COMPOSITIONS INCORPORATING SILICA FIBERS
Embodiments of the invention include articles incorporating fibrous fragments of mats of silica fibers and methods for producing such articles. The fiber mats may be formed via electrospinning of a sol gel produced with a silicon alkoxide reagent, such as tetraethyl ortho silicate, alcohol solvent, and an acid catalyst.
LATEX COMPOSITION AND ONE-PACK TYPE AQUEOUS ADHESIVE COMPOSED OF SAID LATEX COMPOSITION
A latex composition gives favorable initial adhesive strength after short drying period, shows storage stability and spray coating characteristics and gives a soft adhesive layer after drying and a one-pack type aqueous adhesive. The latex composition includes a chloroprene-based polymer latex (A) containing a chloroprene-based polymer in an amount of 50 to 85 mass % as solid matter and an acrylic polymer latex (B) having a glass transition temperature of 52 to 9 C. and containing an acrylic polymer containing a sodium alkylbenzenesulfonate having a structure represented by the Chemical Formula (1) in an amount of 15 to 50 mass % as solid matter, in a total amount of 100 parts by mass, and additionally at least one pH regulator (C) selected from boric acid, ammonium sulfate, and amino acids having an isoelectric point of 5.5 to 6.5 in an amount of 3 to 13 parts by mass as solid matter.
Optical fiber splice element and optical network
An optical network comprises a fiber distribution cable and a terminal assembly. The terminal assembly receives a plurality of optical fibers from the fiber distribution cable and distributes one or more individual fibers to one or more single fiber bare-fiber holders that hold and protect each single fiber prepared and configured for splicing via an individual splicing element. The splicing element includes an alignment mechanism having a base plate and a clamp plate. At least one of the base plate and clamp plate is formed from a silica material and at least one of the base plate and clamp plate includes an alignment groove or channel configured to receive the first and second optical fibers in an end-to-end manner. The splice element also comprises an optical adhesive disposed in at least a portion of the alignment groove, wherein the optical adhesive is curable via actinic radiation.
CURABLE COMPOSITION, METHOD FOR PRODUCING CURABLE COMPOSITION, CURED PRODUCT, AND USE OF CURABLE COMPOSITION
The invention is a curable composition comprising the following component (A), component (B) and component (C), Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following specific formula (a-1)
R.sup.1SiO.sub.3/2(a-1) Component (B): a particulate having an average primary particle diameter of 5 to 40 nm Component (C): a particulate having an average primary particle diameter of larger than 0.04 m to 8 m, and a method for producing the curable composition, and a cured product obtained by curing the curable composition, and a method for using the curable composition as an adhesive for an optical element-fixing material, and a method for using the curable composition as a sealant for an optical element-fixing material.
One aspect of the curable composition according to the invention can provide a cured product excellent in adhesiveness, peeling resistance and heat resistance, and a curable composition excellent in workability in coating process.
Method for curing resin composition
The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.
Method for curing resin composition
The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.
CURABLE RESIN COMPOSITION
A liquid thermally expandable curable resin composition for use such as bonding by tilling a clearance has difficulty in achieving both drying property and film forming property and also has a problem with storage stability. The problems were solved with a curable resin composition having the following composition. A curable resin composition comprises: (A) a film forming resin, (B) an epoxy resin, (C) an organic solvent, (D) thermally expandable particles, and (E) a curing agent ingredient for the (B). The (C) is selected from organic solvents having a boiling point of 100? C. or less and being liquid at normal temperature and contains a combination of (C-1) an ester-based solvent and (C-2) one or more solvents selected from ketone-based solvents, ether-based solvents, and glycol-based solvents, and a content ratio between the (C-1) and the (C-2) in a mass ratio is in a range of (C-1)/(C-2)=0.12 to 0.23.