C09J11/00

Method for evaluating binder

A method for evaluating a binder includes disposing the binder on a first plate, bringing a second plate, which faces the first plate, into contact with one surface of the binder, applying a stress to the binder through the second plate, measuring a strain of the binder due to the applied stress, and calculating a curing rate of the binder based on the strain of the binder.

Moisture-curable reactive hot-melt adhesive composition and method for producing the same

A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.

Moisture-curable reactive hot-melt adhesive composition and method for producing the same

A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.

GAP MATERIAL, ADHESIVE, AND DISPLAY DEVICE

There is provided an adhesive capable of improving the visibility and controlling gaps with high accuracy. The adhesive according to the present invention is an adhesive containing a curable component and a gap material, in which the 10% K value of the gap material is 10000 N/mm.sup.2 or less, and the absolute value of the difference between the refractive index of a cured product obtained by curing the curable component at 23° C. for 1 hour and the refractive index of the gap material is 0.1 or less.

SEMICONDUCTOR ADHESIVE COMPOSITION AND SEMICONDUCTOR ADHESIVE FILM COMPRISING CURED PRODUCT THEREOF

The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.

AQUEOUS FLAME RETARDANT ADHESIVE COMPOSITION AND METHOD FOR PREPARING SAME
20230167338 · 2023-06-01 ·

This invention relates to an aqueous flame retardant adhesive composition that is environment-friendly, reduces cost through replacement of organic flame retardant, improves layer separation of adhesive according to the addition of inorganic flame retardant, and exhibits excellent adhesive strength, low temperature stability, processability and extraction resistance, and a method for preparing the same.

Adhesive composition and method for preparing same

Provided is an adhesive composition including lysine, itaconic acid, and water, wherein the lysine and the itaconic acid are present in the form of an aqueous solution of a salt such that precipitates are not formed in the aqueous solution. In addition, provided is a method of preparing an adhesive composition including mixing lysine, itaconic acid, and water to thereby form a mixture of the lysine, the citric acid, and the water, and stirring the mixture at a temperature of 80° C. or less, wherein amounts of the lysine, the itaconic acid, and the water are adjusted such that precipitates of the lysine and the itaconic acid do not form in the adhesive composition.

Aqueous Coagulatable Polymer Dispersion and Use Thereof as an Adhesive
20170291965 · 2017-10-12 · ·

The invention relates to an aqueous coagulatable polymer dispersion comprising at least one polymer which is dispersed in an aqueous phase, thermoplastic micro-spheres which contain a propellant, and at least one additional component which is selected from the group consisting of polyols, polyamines, and thermoplastic polymers. The invention further relates to a coagulate which can be obtained by the thermal and/or mechanical and/or ultrasonically-initiated coagulation of the aqueous polymer dispersion according to the invention, to an adhesive comprising or consisting of the coagulate, to a substrate which is completely or partly coated with said coagulate, to a method for producing such a coated substrate, and to coated substrates which can be obtained using said method. The coagulate can be used as an adhesive or as a binder in 3D-printing methods.

Hard surface cleaning article comprising an adhesive

The present invention relates to articles for cleaning hard surfaces and in particular to remove large particles and hairs from large surfaces. The articles comprise an adhesive having specific Theological properties that provide increased efficacy in capturing and trapping large particles and hairs.

Image analysis of applied adhesive with fluorescence enhancement

Systems and methods are described herein for analyzing the application of adhesives. An adhesive comprising a fluorescent property is applied to a component. The component is illuminated using one or more of wavelengths of light from a light source, wherein the adhesive is configured to absorb the one or more wavelengths of light and fluoresce in response. An image of the component is captured using a camera while the component is illuminated using the light source. One or more fluorescence characteristics from the image are determined and a state of the applied adhesive is determined based on the one or more fluorescence characteristics.