Patent classifications
C09J11/00
Image analysis of applied adhesive with fluorescence enhancement
Systems and methods are described herein for analyzing the application of adhesives. An adhesive comprising a fluorescent property is applied to a component. The component is illuminated using one or more of wavelengths of light from a light source, wherein the adhesive is configured to absorb the one or more wavelengths of light and fluoresce in response. An image of the component is captured using a camera while the component is illuminated using the light source. One or more fluorescence characteristics from the image are determined and a state of the applied adhesive is determined based on the one or more fluorescence characteristics.
Filling-bonding material, protective sheet-equipped filling-bonding material, laminated body, optical device, and protective panel for optical device
The present invention aims to provide a filling-bonding material that is suitably used to fill a space between parts, while bonding the parts, in optical devices in various shapes not limited to flat shapes. The present invention also aims to provide a protective sheet-equipped filling-bonding material, a laminate, an optical device, and a protective panel for an optical device each including the filling-bonding material. Provided is a filling-bonding material having a shape with an uneven thickness.
COMPOSITIONS INCORPORATING SILICA FIBERS
Embodiments of the invention include articles incorporating fibrous fragments of mats of silica fibers and methods for producing such articles. The fiber mats may be formed via electrospinning of a sol gel produced with a silicon alkoxide reagent, such as tetraethyl ortho silicate, alcohol solvent, and an acid catalyst.
COMPOSITIONS INCORPORATING SILICA FIBERS
Embodiments of the invention include articles incorporating fibrous fragments of mats of silica fibers and methods for producing such articles. The fiber mats may be formed via electrospinning of a sol gel produced with a silicon alkoxide reagent, such as tetraethyl ortho silicate, alcohol solvent, and an acid catalyst.
Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
ADHESIVE COMPOSITION, ADHESIVE LAYER AND ADHESIVE SHEET
The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.
High temperature epoxy adhesive formulations
The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol.
Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same
Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thermo-compression bonding may include a flux activator, solder particles and polymer resin.
ADHESIVE GEL NAIL AND MANUFACTURING METHOD THEREOF
An adhesive gel nail for remarkably increasing colorability, durability and permeability, and a manufacturing method thereof are provided, wherein the adhesive gel nail according to one aspect of the present invention includes: an adhesive layer; a color base layer formed on the adhesive layer; and a colored layer formed on the color base layer.