Patent classifications
C09J109/00
PRESSURE-SENSITIVE ADHESIVE FILM AND METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE USING THE SAME
Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.
Electrochemical energy storage device
The present disclosure provides an electrochemical energy storage device, which comprises a cell, an electrolyte and a package. The electrochemical energy storage device further comprises a binding material positioned between the cell and the package. The binding material comprises an adhesive layer and a covering layer. The adhesive layer is directly or indirectly adhered and positioned on an outer surface of the cell, and a surface of the adhesive layer which is far away from the cell is an adhesive surface; the covering layer is positioned on the adhesive surface of the adhesive layer, the covering layer is dissolved or swollen into the electrolyte in whole or in part so as to expose the adhesive surface of the adhesive layer, therefore the adhesive layer can make the cell adhered with the package. The covering layer is a polar molecule, the polar molecule comprises one or more selected from the group consisting of F, CONH, NHCONH, and NHCOO. The electrochemical energy storage device of the present disclosure may not only fixedly connect the cell to the package so as to resolve the problems during the drop test, but also may resolve the problem that the cell is difficult to put into the package because the two surfaces of the binding material are both adhesive, the electrochemical energy storage device also has an excellent cycle performance and an excellent charge-discharge performance under a high rate.
Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
Hot melt adhesive
The present invention provides a hot melt adhesive which is excellent in environmental friendliness, thermal stability, adhesion to a polyolefin substrate and a polyester substrate, and heat resistance. The present invention relates to a hot melt adhesive comprising (A) a polar functional group-modified conjugated diene-based polymer, (B) an aliphatic polyester-based resin, (C) an amorphous olefin-based polymer, (D) a crystalline polypropylene resin, and (E) a tackifier resin.
Hot melt adhesive
The present invention provides a hot melt adhesive which is excellent in environmental friendliness, thermal stability, adhesion to a polyolefin substrate and a polyester substrate, and heat resistance. The present invention relates to a hot melt adhesive comprising (A) a polar functional group-modified conjugated diene-based polymer, (B) an aliphatic polyester-based resin, (C) an amorphous olefin-based polymer, (D) a crystalline polypropylene resin, and (E) a tackifier resin.
Acrylate-terminated urethane polybutadienes from low-monomer 1:1 monoadducts from reactive olefinic compounds and diisocyanates and hydroxy-terminated polybutadienes for liquid optically clear adhesives (LOCAs)
The present invention relates to an optical clear resin and a method for producing a liquid optical clear photo-curable adhesive.
Acrylate-terminated urethane polybutadienes from low-monomer 1:1 monoadducts from reactive olefinic compounds and diisocyanates and hydroxy-terminated polybutadienes for liquid optically clear adhesives (LOCAs)
The present invention relates to an optical clear resin and a method for producing a liquid optical clear photo-curable adhesive.
Resin composition and display unit
A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer can have a transmittance of 90% or higher in the visible range and a storage modulus at 25? C. of 1?10.sup.7 Pa or less. The cured resin layer can be formed from a resin composition that has a cure shrinkage of 5% or less.
Resin composition and display unit
A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer can have a transmittance of 90% or higher in the visible range and a storage modulus at 25? C. of 1?10.sup.7 Pa or less. The cured resin layer can be formed from a resin composition that has a cure shrinkage of 5% or less.