Disclosed is a moisture curable composition comprising a reactive or curable silicone; a crosslinker; an unreactive silicone; and at least of an initial strength-imparting agent and a plasticizer. The composition can have superior waterproofing property and weatherproofing property and allows easy installation on a substrate and easy peeling from the substrate.

A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.

A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.

A reinforcing carbon fiber sheet (1) of the present invention includes: a carbon fiber filament (2) group arrayed in parallel in one direction; and a thermoplastic adhesive (4) present on at least part of the carbon fiber filament group in a direction across the carbon fiber filament group to unite the carbon fiber filament group. Preferably, the reinforcing sheet (1) includes a minimum amount of the carbon fibers required to produce a reinforcing effect. A sizing layer (3) of an epoxy-based resin is present on the surface of the carbon fiber filaments (2), and has a high affinity for the thermoplastic adhesive layer (4) present thereon, so that they strongly adhere to each other. Thus, the present invention provides a reinforcing carbon fiber sheet that is thin, has good handling properties and easily adheres to a substance to be reinforced.

The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.

The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.

An elongated printing tape includes a heat-sensitive layer, a first protective layer, a second protective layer, and a first adhesive layer. The heat-sensitive layer produce color at temperatures within a prescribed range. The first protective layer is provided on the heat-sensitive layer. The second protective layer is provided on the side of the heat-sensitive layer opposite the first protective layer. The second protective layer contains at least one resin selected from a group consisting of fluorine-based resins, silicone-based resins, olefin-based resins, polyester-based resins, epoxy/polyester-based resins, and silicon-based resins. The first adhesive layer is provided on the side of the second protective layer opposite the heat-sensitive layer. The first adhesive layer contains at least one adhesive selected from a group consisting of (a) emulsion-type adhesive compounded with tackifying resin and containing acrylic polymer and rubber-based adhesive, (b) silicone-based adhesive, and (c) rubber-based adhesive.

An adhesive containing silicone, in the form of an adhesive compound which contains at least a first adhesive component and a second adhesive component containing silicone is provided. The second, silicon-laced adhesive component consists of a non-crosslinked polysiloxane. The kinematic viscosity of the non-crosslinked polysiloxane is at least 100,000 mm.sup.2/s and at most 10,000,000 mm.sup.2/s or that the molar mass of the non-crosslinked polysiloxane is less than 10,000 g/mol, and the second, silicone-containing adhesive component is microencapsulated. Alternatively it can be provided that the molar mass of the polysiloxane is at least 80,000 g/mol and at most 500,000 g/mol, or that the kinematic viscosity of the non-crosslinked polysiloxane is less than 100,000 mm.sup.2/s, and the second, silicone-containing adhesive component is microencapsulated.

Provided is a masking tape for a shot peening process, including: a substrate having a first surface and a second surface; and a pressure-sensitive adhesive layer disposed on the first surface of the substrate. The masking tape has a breaking strength of 55 N/15 mm or more and exhibits an impact absorption rate of 20% or more in a falling ball impact test. Further, the masking tape has a displacement distance of 2 mm or less after 1 h from an initial position in a holding power test at 40 C. which is performed by applying a load of 500 g.

The subject technology relates to an adhesion promoter that is applied to a surface for the purpose of adhesion and/or to facilitate application of various spray applied conformal coatings.