A base polymer for hot-melt adhesive, containing a propylenic polymer (A) having a tensile modulus of elasticity of 60 MPa or more, and an olefinic polymer (B) having a tensile modulus of elasticity of less than 60 MPa, wherein, relative to 100 parts by mass of the total amount of the propylenic polymer (A) and the olefinic polymer (B), the content of the propylenic polymer (A) is 1 part by mass or more and less than 50 parts by mass, and the content of the olefinic polymer (B) is more than 50 parts by mass and 99 parts by mass or less; and a hot-melt adhesive containing the base polymer, and further containing at least one of (C) a tackifier resin and (D) an oil.

An article includes a substrate including a bonding surface area, a first adhesive disposed on the bonding surface area in a first discrete pattern, the first adhesive comprising a hot melt adhesive, and a second adhesive disposed on the bonding surface area in a second discrete pattern that is complementary to the first discrete pattern, wherein the first discrete pattern comprises about 1% to about 25% of the bonding surface area and the second discrete pattern comprises a balance of the bonding surface area.

An article includes a substrate including a bonding surface area, a first adhesive disposed on the bonding surface area in a first discrete pattern, the first adhesive comprising a hot melt adhesive, and a second adhesive disposed on the bonding surface area in a second discrete pattern that is complementary to the first discrete pattern, wherein the first discrete pattern comprises about 1% to about 25% of the bonding surface area and the second discrete pattern comprises a balance of the bonding surface area.

A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

As an adhesive for the lamination of metal foil and a resin film, an adhesive that can stably exhibit good adhesiveness and moreover can provide a laminate having better electrolytic solution resistance and heat resistance is provided. An adhesive comprising a polyolefin resin (A) having a carboxyl group; and polyisocyanate compounds (B), wherein the polyisocyanate compounds (B) .sub.comprise a polymer of a saturated aliphatic polyisocyanate (B1), a polymer of a saturated alicyclic polyisocyanate (B2), and a polymer of an aromatic polyisocyanate (B3).

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

In an aqueous dispersion containing a resin component and water that allows the resin component to disperse, the resin component contains composite particles (C) containing an ethylene-unsaturated carboxylic acid copolymer (A) and an acrylic polymer (B), the ethylene-unsaturated carboxylic acid copolymer (A) is produced by copolymerizing a first monomer component containing ethylene and unsaturated carboxylic acid and having an ethylene content of 75 mass % or more, the acrylic polymer (B) is produced by polymerizing a second monomer component containing (meth)acrylate and having a (meth)acrylate content of 50 mass % or more, the acrylic polymer (B) has a glass transition temperature of 28 C. or more and 80 C. or less, and the ethylene-unsaturated carboxylic acid copolymer (A) content relative to the total amount of the resin component is 58 mass % or more and 90 mass % or less.

In an aqueous dispersion containing a resin component and water that allows the resin component to disperse, the resin component contains composite particles (C) containing an ethylene-unsaturated carboxylic acid copolymer (A) and an acrylic polymer (B), the ethylene-unsaturated carboxylic acid copolymer (A) is produced by copolymerizing a first monomer component containing ethylene and unsaturated carboxylic acid and having an ethylene content of 75 mass % or more, the acrylic polymer (B) is produced by polymerizing a second monomer component containing (meth)acrylate and having a (meth)acrylate content of 50 mass % or more, the acrylic polymer (B) has a glass transition temperature of 28 C. or more and 80 C. or less, and the ethylene-unsaturated carboxylic acid copolymer (A) content relative to the total amount of the resin component is 58 mass % or more and 90 mass % or less.

The present application discloses an adhesive composition comprising a polymer of the formulae A, B and C and methods for using the adhesive composition.