A device for indicating exposure to a pressure. The device may include a base layer, a plurality of microcapsules, and a coating, with the microcapsules being disposed between the base layer and the coating. The microcapsules contain a indicator material that can be released once the microcapsules burst. The microcapsules then have a compressive bursting strength that is chosen or designed to be less than a selected pressure (e.g., the pressure being that to which a particular article may be exposed during high pressure processing). Thus, when the device is subjected to a pressure greater than the compressive bursting strength, at least some microcapsules burst, the indicator material is released from the microcapsules, and the release of the indicator material can be detected by observation of the device. The device may be a label that is associated (such as by being affixed) to the article being subjected to pressure (or multiple labels being associated (such as by being affixed) to multiple articles. Alternatively, the device may be associated with an article or articles without being affixed thereto.

An object of the present invention is to provide a surface modifier composition that is capable of performing surface modification of various types of hardly adhesive materials, and of improving adhesion with respect to various types of hardly adhesive materials, and an adhesion method using the same. The present invention relates to a surface modifier composition, containing: an (A) component: a hydrogen abstraction type radical initiator; a (B) component: a silane compound having a hydrolyzable silyl group, and one or more functional groups which are at least one type of functional group selected from the group consisting of radical polymerizable functional groups and mercapto groups; and a (C) component: at least one compound selected from the group consisting of a (C1) specific silane compound and a (C2) condensation reaction catalyst, in which the surface modifier composition is used in surface modification of an adherend containing a resin having a hydrocarbon bond.

An object of the present invention is to provide a surface modifier composition that is capable of performing surface modification of various types of hardly adhesive materials, and of improving adhesion with respect to various types of hardly adhesive materials, and an adhesion method using the same. The present invention relates to a surface modifier composition, containing: an (A) component: a hydrogen abstraction type radical initiator; a (B) component: a silane compound having a hydrolyzable silyl group, and one or more functional groups which are at least one type of functional group selected from the group consisting of radical polymerizable functional groups and mercapto groups; and a (C) component: at least one compound selected from the group consisting of a (C1) specific silane compound and a (C2) condensation reaction catalyst, in which the surface modifier composition is used in surface modification of an adherend containing a resin having a hydrocarbon bond.

A curable resin film of the present invention forms a first protective film (la) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 μm, an average diameter of 60 to 500 μm, and an average pitch of 100 to 800 μm, heating the attached curable resin film at 100° C. to 200° C. for 0.5 to 3 hours, and curing the heated curable resin film, and when longitudinal sections thereof are observed by a scanning electron microscope, a ratio (h3/h1) of an average thickness (h3) of the first protective film (1a) at a center position between the bumps (51) to an average peak height (h1) of the bumps (51), and a ratio (h2/h1) of an average thickness (h2) of the first protective film (1a) at a position being in contact with the plurality of bumps (51) to the average peak height (h1) satisfy a relationship represented by the following expression of [{(h2/h1)−(h3/h1)}≤0.1].

Adhesive compositions exhibiting antimicrobial properties, good stability, long shelf lives and enhanced release of antimicrobial agents are described. In certain versions, the compositions also exhibit relatively high fluid handling capacities. The adhesive compositions inhibit microbial growth by more than 2 log after 24 hours contact and particularly more than 3.5 log after 6 hours contact. Also described are various medical articles using such adhesives and related methods.

Adhesive compositions exhibiting antimicrobial properties, good stability, long shelf lives and enhanced release of antimicrobial agents are described. In certain versions, the compositions also exhibit relatively high fluid handling capacities. The adhesive compositions inhibit microbial growth by more than 2 log after 24 hours contact and particularly more than 3.5 log after 6 hours contact. Also described are various medical articles using such adhesives and related methods.

The present technology provides a reactive hot-melt adhesive including a urethane prepolymer formed from a polyol and a polyisocyanate; and a thermoplastic poly (meth)acrylic resin; the polyol including a bifunctional polyol including polypropylene glycol and polyethylene glycol, a trifunctional polyol, and a polyester polyol having a glass transition temperature of from 20 to 60° C.

Provided is an adhesive composition for coating-type polarization elements containing a (meta)acrylic polymer (A), an ultraviolet absorber (B), and a radical polymerization initiator (C), wherein an adhesive layer formed from the adhesive composition has a transmittance at a wavelength of 400 nm of 50% or less, and the adhesive composition can be used in combination with a coating-type polarization element to prevent the coating-type polarization element from deteriorating polarization performance over time due to exposure.

The present disclosure provides an adhesive composition comprising an acrylic resin (A) and a hydrophilicity imparting agent (B), wherein the acrylic resin (A) is a copolymer of a copolymerization component (a) containing a methacrylic acid alkyl ester monomer having an alkyl chain with 10 to 36 carbon atoms (a1), and a polar group-containing ethylenic unsaturated monomer (a2), the content of the polar group-containing ethylenic unsaturated monomer (a2) is less than 3 wt. % with respect to the copolymerization component (a), and the hydrophilicity imparting agent (B) contains a compound (B1) that has a structure represented by —(C.sub.nH.sub.2nO).sub.m— (n is 2 to 6 and m is 2 to 25) and contains at least one ethylenic unsaturated group.

The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.