Polymeric materials are disclosed herein that include a reaction product of components comprising: a) a first amine component having at least two and at most three primary amino groups, secondary amino groups, or a mixture thereof, with the proviso that the first amine component is not a silicone diamine; b) a second amine component having (i) greater than three primary amino groups, or (ii) at least three primary amino groups and a plurality of secondary amino groups, wherein the second amine component is a polymeric material having a carbon backbone or a polymeric material having a carbon backbone with a plurality of catenated nitrogen atoms; and c) an oxalate ester.

Polymeric materials are disclosed herein that include a reaction product of components comprising: a) a first amine component having at least two and at most three primary amino groups, secondary amino groups, or a mixture thereof, with the proviso that the first amine component is not a silicone diamine; b) a second amine component having (i) greater than three primary amino groups, or (ii) at least three primary amino groups and a plurality of secondary amino groups, wherein the second amine component is a polymeric material having a carbon backbone or a polymeric material having a carbon backbone with a plurality of catenated nitrogen atoms; and c) an oxalate ester.

The invention relates to a novel binder system and its use for bonding textile fabrics as well as products containing such bonded textile fabrics. The materials according to the invention are suitable for the manufacture of base interlinings, optionally in combination with at least one further textile fabric, for coated sarking membranes, roofing sheets and water-proof sheetings, as a textile backing or a textile reinforcement in floorings, in particular in carpets and PVC floorings, or in facer, wall coating inside and outside of buildings as well as in furniture.

The invention relates to a novel binder system and its use for bonding textile fabrics as well as products containing such bonded textile fabrics. The materials according to the invention are suitable for the manufacture of base interlinings, optionally in combination with at least one further textile fabric, for coated sarking membranes, roofing sheets and water-proof sheetings, as a textile backing or a textile reinforcement in floorings, in particular in carpets and PVC floorings, or in facer, wall coating inside and outside of buildings as well as in furniture.

To provide a material for a printed circuit board which is less likely to be warped in a high temperature region (from 150 to 200 C.) while maintaining electrical properties, a metal laminate, methods for producing them, and a method for producing a printed circuit board.

A material having a fluorinated resin layer is subjected to a heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320 C. and a melt flow rate of at least 2 g/10 min measured at 372 C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250 C. and lower by at least 5 C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.

An objective of the present invention is to provide a curable resin composition capable of offering a cured product having excellent electroconductivity and curability. The invention is a curable resin composition containing: (A) a cyanate ester resin; (B) an epoxy resin; (C) a latent curing agent including an amine-based latent curing agent having an active hydrogen and obtained by causing reaction between an amine compound and an epoxy compound; and (D) an electroconductive filler. Preferably, the latent curing agent, which is component (C), further contains a phenolic resin. Preferably, the electroconductive filler, which is component (D), is at least one type selected from silver particles and copper particles.

An objective of the present invention is to provide a curable resin composition capable of offering a cured product having excellent electroconductivity and curability. The invention is a curable resin composition containing: (A) a cyanate ester resin; (B) an epoxy resin; (C) a latent curing agent including an amine-based latent curing agent having an active hydrogen and obtained by causing reaction between an amine compound and an epoxy compound; and (D) an electroconductive filler. Preferably, the latent curing agent, which is component (C), further contains a phenolic resin. Preferably, the electroconductive filler, which is component (D), is at least one type selected from silver particles and copper particles.

Compositions for binding organic or inorganic fibers is described. The compositions may include an aqueous solution having a pH of about 4.5 or more. The aqueous solution may include a polycarboxy polymer that is about 10%, by wt., to 100%, by wt., of a butenedioic acid or butenedioic anhydride; and a polyol. The compositions can maintain a pH of about 5 or more after being cured into a thermoset plastic with the fibers. Processes for preparing a binder composition for organic or inorganic fibers are also described. The processes may include providing an aqueous solution of polycarboxylic acid polymers, where the polymers comprise about 10%, by wt., to 100%, by wt., of a butenedioic acid or butenedioic anhydride; adding a polyol to the aqueous solution; and maintaining the pH of the aqueous solution at about 5 or more.

The present application relates to a resin composition and in particular to a light-curable resin composition.

It is known to achieve a thixotropic behavior of an adhesive composition by adding an inorganic additive like fumed silica. Adding inorganic additives results in significant particle problems as fumed silica is a solid particle and affects the optical performance of the adhesive composition.

In accordance with the invention a particle free resin composition with a thixotropic behavior is provided. The inventive composition comprises a) 30 to 90 wt % of a urethane acrylate oligomer with a molecular weight greater than 15000, b) 2 to 40 wt % of a (meth)acrylate monomer having a benzene ring, and c) 0.2 to 10 wt % of a photo initiator.

The present application relates to a resin composition and in particular to a light-curable resin composition.

It is known to achieve a thixotropic behavior of an adhesive composition by adding an inorganic additive like fumed silica. Adding inorganic additives results in significant particle problems as fumed silica is a solid particle and affects the optical performance of the adhesive composition.

In accordance with the invention a particle free resin composition with a thixotropic behavior is provided. The inventive composition comprises a) 30 to 90 wt % of a urethane acrylate oligomer with a molecular weight greater than 15000, b) 2 to 40 wt % of a (meth)acrylate monomer having a benzene ring, and c) 0.2 to 10 wt % of a photo initiator.