Provided are a hydrocarbon resin and a method of preparing the same, wherein thermal polymerization of a diolefin and an olefin is performed, thus obviating a catalyst removal process, material supply problems can be solved, and a hydrogenated hydrocarbon resin can be prepared using a catalyst, which is inexpensive and is easy to handle, thereby realizing a yield and a preparation process that enable real-world application thereof. The hydrogenated hydrocarbon resin prepared by the method of the invention has excellent compatibility and a low specific viscosity, and can thus be efficiently used as a tackifier or an adhesive in a variety of fields.

Provided are a hydrocarbon resin and a method of preparing the same, wherein thermal polymerization of a diolefin and an olefin is performed, thus obviating a catalyst removal process, material supply problems can be solved, and a hydrogenated hydrocarbon resin can be prepared using a catalyst, which is inexpensive and is easy to handle, thereby realizing a yield and a preparation process that enable real-world application thereof. The hydrogenated hydrocarbon resin prepared by the method of the invention has excellent compatibility and a low specific viscosity, and can thus be efficiently used as a tackifier or an adhesive in a variety of fields.

Provided is a thermoplastic resin composition or an adhesive coating material capable of adhering a cyclic polyolefin-based polymer with a metal or metal compound such as aluminum foil or an ethylene-vinyl alcohol copolymer with sufficient strength. The thermoplastic resin composition contains (A) 100 parts by mass of thermoplastic resin; (B) 0.05 to 5 parts by mass of one or more kinds selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid derivative; and (C) 0.01 to 3 parts by mass of organic peroxide; which component (A) contains (a1) 10 to 90% by mass cyclic polyolefin-based polymer; and (a2) 90 to 10% by mass a hydrogenated product of a block copolymer comprising a polymer block composed mainly of an aromatic vinyl compound and a random copolymer block of a conjugated diene compound and an aromatic vinyl compound (with the proviso that the total of the component (a1) and the component (a2) is 100% by mass).

Provided is a thermoplastic resin composition or an adhesive coating material capable of adhering a cyclic polyolefin-based polymer with a metal or metal compound such as aluminum foil or an ethylene-vinyl alcohol copolymer with sufficient strength. The thermoplastic resin composition contains (A) 100 parts by mass of thermoplastic resin; (B) 0.05 to 5 parts by mass of one or more kinds selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid derivative; and (C) 0.01 to 3 parts by mass of organic peroxide; which component (A) contains (a1) 10 to 90% by mass cyclic polyolefin-based polymer; and (a2) 90 to 10% by mass a hydrogenated product of a block copolymer comprising a polymer block composed mainly of an aromatic vinyl compound and a random copolymer block of a conjugated diene compound and an aromatic vinyl compound (with the proviso that the total of the component (a1) and the component (a2) is 100% by mass).

Provided are a laminate that can be used as a microchannel chip that maintains joint strength while also displaying good external appearance and having reduced risk of liquid leakage from a channel and a method for manufacturing the same. The laminate includes a channel-equipped substrate having a cycloolefin polymer as a material and a cover material having a cycloolefin polymer as a material that are joined via a joining agent having a mixture of two or more cycloolefin polymers as a material. A glass-transition temperature of the mixture of cycloolefin polymers that is a material of the joining agent is not less than 20 C. lower than both a glass-transition temperature of the cycloolefin polymer that is a material of the channel-equipped substrate and a glass-transition temperature of the cycloolefin polymer that is a material of the cover material and is not lower than 68 C. and not higher than 138 C.

A method of preparing an anode of lithium ion batteries or an electrode plate of a supercapacitor. The method includes admixing a terpene resin-based aqueous binder. The terpene resin-based aqueous binder includes a terpene resin emulsion including between 20 and 80 wt. % of a terpene resin, and the terpene resin emulsion has a viscosity of between 2000 and 10000 mPa.Math.s.

A method of preparing an anode of lithium ion batteries or an electrode plate of a supercapacitor. The method includes admixing a terpene resin-based aqueous binder. The terpene resin-based aqueous binder includes a terpene resin emulsion including between 20 and 80 wt. % of a terpene resin, and the terpene resin emulsion has a viscosity of between 2000 and 10000 mPa.Math.s.

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.

The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200 C. PECVD processing.