The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200 C. PECVD processing.

The invention relates to a method for preparing hydrogenated petroleum resin. More specifically, the invention relates to a method for preparing hydrogenated petroleum resin having aromaticity of 10% or more and exhibiting excellent color and thermal stability, through a hydrogenation reaction in a slurry reactor, using a selective hydrogenation catalyst having excellent selectivity to olefinic double bonds in petroleum resin.

The invention relates to a method for preparing hydrogenated petroleum resin. More specifically, the invention relates to a method for preparing hydrogenated petroleum resin having aromaticity of 10% or more and exhibiting excellent color and thermal stability, through a hydrogenation reaction in a slurry reactor, using a selective hydrogenation catalyst having excellent selectivity to olefinic double bonds in petroleum resin.

A solvent blend useable for tackifying a surface of a plastic film includes a terpene based solvent and one or more of a solvent from the group consisting of a straight chain alkane, a branched chain alkane, a cyclic alkane, a substituted cyclic alkane, a straight chain ether, a branched chain ether, a cyclic ether, a substituted cyclic ether, a cyclic diether, a substituted cyclic diether, a straight chain ketone, a branched chain ketone, a cyclic ketone, a substituted cyclic ketone, a straight chain ester, and a branched chain ester.

A solvent blend useable for tackifying a surface of a plastic film includes a terpene based solvent and one or more of a solvent from the group consisting of a straight chain alkane, a branched chain alkane, a cyclic alkane, a substituted cyclic alkane, a straight chain ether, a branched chain ether, a cyclic ether, a substituted cyclic ether, a cyclic diether, a substituted cyclic diether, a straight chain ketone, a branched chain ketone, a cyclic ketone, a substituted cyclic ketone, a straight chain ester, and a branched chain ester.

Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25 C. as a 25% (by weight) toluene solution of not more than 250 mPa.Math.s (A1).

Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25 C. as a 25% (by weight) toluene solution of not more than 250 mPa.Math.s (A1).

The present application provides a pressure-sensitive adhesive film, an organic electronic device including the same and a method of manufacturing an organic electronic device using the same. The present application provides the pressure-sensitive adhesive film which forms a structure effectively blocking water or oxygen from penetrating into an organic electronic device from the outside, and has excellent mechanical properties such as handleability, formability or the like and transparency.

The present application provides a pressure-sensitive adhesive film, an organic electronic device including the same and a method of manufacturing an organic electronic device using the same. The present application provides the pressure-sensitive adhesive film which forms a structure effectively blocking water or oxygen from penetrating into an organic electronic device from the outside, and has excellent mechanical properties such as handleability, formability or the like and transparency.

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, including a thermoplastic resin and a release agent.