A polymer film comprises a polymer composition containing (A) a cyclic olefin polymer and (B) a chlorine-containing polymer. The chlorine-containing polymer (B) may comprise a vinylidene chloride-series polymer. The cyclic olefin polymer (A) may comprise a cyclic olefin copolymer. The ratio of the chlorine-containing polymer (B) relative to 100 parts by weight of the cyclic olefin polymer (A) may be 0.5 to 60 parts by weight. The film has a moderate releasability from an electrolyte membrane and an electrode membrane of a polymer electrolyte fuel cell and a moderate adhesion to the electrolyte membrane and the electrode membrane and can adhere to a commonly-used substrate film without interposition of an adhesive layer such as an easily adhesive layer. The film is thus suitable as a release film for producing a membrane electrode assembly of a polymer electrolyte fuel cell.

A polymer film comprises a polymer composition containing (A) a cyclic olefin polymer and (B) a chlorine-containing polymer. The chlorine-containing polymer (B) may comprise a vinylidene chloride-series polymer. The cyclic olefin polymer (A) may comprise a cyclic olefin copolymer. The ratio of the chlorine-containing polymer (B) relative to 100 parts by weight of the cyclic olefin polymer (A) may be 0.5 to 60 parts by weight. The film has a moderate releasability from an electrolyte membrane and an electrode membrane of a polymer electrolyte fuel cell and a moderate adhesion to the electrolyte membrane and the electrode membrane and can adhere to a commonly-used substrate film without interposition of an adhesive layer such as an easily adhesive layer. The film is thus suitable as a release film for producing a membrane electrode assembly of a polymer electrolyte fuel cell.

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200 C. PECVD processing.

The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200 C. PECVD processing.

The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized and an additive package containing a phenolic antioxidant and a diaryl amine synergist, and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.

The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized and an additive package containing a phenolic antioxidant and a diaryl amine synergist, and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.

Provided are a resin composition for a tackifier or an adhesive and a preparation method thereof. Provided is a resin composition for a tackifier or an adhesive, which includes a hydrogenated petroleum resin with a controlled hydrogenation rate to have excellent compatibility with polyolefin and to exhibit high transparency while having improved quality including adhesive property.

Provided are a resin composition for a tackifier or an adhesive and a preparation method thereof. Provided is a resin composition for a tackifier or an adhesive, which includes a hydrogenated petroleum resin with a controlled hydrogenation rate to have excellent compatibility with polyolefin and to exhibit high transparency while having improved quality including adhesive property.