C09J145/00

Resin composition for tackifier or adhesive and preparation method thereof

Provided are a resin composition for a tackifier or an adhesive and a preparation method thereof. Provided is a resin composition for a tackifier or an adhesive, which includes a hydrogenated petroleum resin with a controlled hydrogenation rate to have excellent compatibility with polyolefin and to exhibit high transparency while having improved quality including adhesive property.

RESIN COMPOSITION FOR TACKIFIER OR ADHESIVE AND PREPARATION METHOD THEREOF
20250368865 · 2025-12-04 ·

Provided are a resin composition for a tackifier or an adhesive and a preparation method thereof. Provided is a resin composition for a tackifier or an adhesive, which includes a hydrogenated petroleum resin with a controlled hydrogenation rate to have excellent compatibility with polyolefin and to exhibit high transparency while having improved quality including adhesive property.

RESIN COMPOSITION FOR TACKIFIER OR ADHESIVE AND PREPARATION METHOD THEREOF
20250368865 · 2025-12-04 ·

Provided are a resin composition for a tackifier or an adhesive and a preparation method thereof. Provided is a resin composition for a tackifier or an adhesive, which includes a hydrogenated petroleum resin with a controlled hydrogenation rate to have excellent compatibility with polyolefin and to exhibit high transparency while having improved quality including adhesive property.

COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
20260071011 · 2026-03-12 ·

An embodiment relates to a compound including: an indene ring; a vinylbenzyl group; and an aromatic ring-containing group of 6 or more carbon atoms without a polymerizable carbon-carbon double bond, in which both of the vinylbenzyl group and the aromatic ring-containing group are directly bonded to the indene ring.

COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
20260071011 · 2026-03-12 ·

An embodiment relates to a compound including: an indene ring; a vinylbenzyl group; and an aromatic ring-containing group of 6 or more carbon atoms without a polymerizable carbon-carbon double bond, in which both of the vinylbenzyl group and the aromatic ring-containing group are directly bonded to the indene ring.