The present invention aims to provide a curable resin composition which has low viscosity as well as properties such as high elongation property, high tensile strength, and hydrogen gas barrier property. A curable resin composition includes the following ingredients (A) to (D): ingredient (A): a vinyl polymer having one or more alkenyl groups in one molecule; ingredient (B): a compound having one or more hydrosilyl groups in one molecule; ingredient (C): a hydrosilylation catalyst; ingredient (D): a polyfunctional vinyl ether compound.

The present invention aims to provide a curable resin composition which has low viscosity as well as properties such as high elongation property, high tensile strength, and hydrogen gas barrier property. A curable resin composition includes the following ingredients (A) to (D): ingredient (A): a vinyl polymer having one or more alkenyl groups in one molecule; ingredient (B): a compound having one or more hydrosilyl groups in one molecule; ingredient (C): a hydrosilylation catalyst; ingredient (D): a polyfunctional vinyl ether compound.

Provided herein are non-naturally occurring microbial organisms having a FaldFP, a FAP and/or metabolic modifications which can further include a MMP, a MOP, a hydrogenase and/or a CODH. These microbial organisms can further include a butadiene, 13BDO, CrotOH, MVC or 3-buten-1-ol pathway. Additionally provided are methods of using such microbial organisms to produce butadiene, 13BDO, CrotOH, MVC or 3-buten-1-ol.

Provided herein are non-naturally occurring microbial organisms having a FaldFP, a FAP and/or metabolic modifications which can further include a MMP, a MOP, a hydrogenase and/or a CODH. These microbial organisms can further include a butadiene, 13BDO, CrotOH, MVC or 3-buten-1-ol pathway. Additionally provided are methods of using such microbial organisms to produce butadiene, 13BDO, CrotOH, MVC or 3-buten-1-ol.

Provided herein is a hot melt pressure sensitive adhesive comprising one or more styrene block copolymers, a tackifier, and polyisobutylene plasticizer, wherein the adhesive contains less than 1 wt % of a plasticizer oil. The adhesive can be used in a label construction along with a facestock such as a polyethylene facestock, wherein the swelling factor of the facestock is reduced as compared to the swelling factor of the facestock in labels that include a plasticizer oil. Also provided are methods for producing and using the hot melt adhesive, and articles labeled with the hot melt adhesive.

Provided herein is a hot melt pressure sensitive adhesive comprising one or more styrene block copolymers, a tackifier, and polyisobutylene plasticizer, wherein the adhesive contains less than 1 wt % of a plasticizer oil. The adhesive can be used in a label construction along with a facestock such as a polyethylene facestock, wherein the swelling factor of the facestock is reduced as compared to the swelling factor of the facestock in labels that include a plasticizer oil. Also provided are methods for producing and using the hot melt adhesive, and articles labeled with the hot melt adhesive.

A method for producing a thin wafer includes: separating the support body from the laminate by irradiating a wafer laminate, which includes a support body, an adhesive layer formed on the support body, and a wafer laminated with a surface thereof including a circuit plane facing the adhesive layer, with light from a side of the support body of the wafer laminate; and after separating, removing a resin layer remaining on the wafer from the wafer by peeling, wherein the adhesive layer includes only a resin layer A with a light-blocking property, and a resin layer B including a thermosetting silicone resin or a non-silicone thermoplastic resin in this order from the side of the support body.

A method for producing a thin wafer includes: separating the support body from the laminate by irradiating a wafer laminate, which includes a support body, an adhesive layer formed on the support body, and a wafer laminated with a surface thereof including a circuit plane facing the adhesive layer, with light from a side of the support body of the wafer laminate; and after separating, removing a resin layer remaining on the wafer from the wafer by peeling, wherein the adhesive layer includes only a resin layer A with a light-blocking property, and a resin layer B including a thermosetting silicone resin or a non-silicone thermoplastic resin in this order from the side of the support body.

The present invention pertains to a stabilized hot melt adhesive containing a) one or more hot melt adhesive materials and b) a stabilizer composition. The one or more hot melt adhesive materials a) include a polyolefin, a styrene-isoprene-styrene block co-polymer, a styrene-butadiene-styrene block co-polymer, a polyacrylate, an acryl-copolymer, an ethylene vinyl acetate, a polyamide, a polyester, a polyurethane, a polyimide, a silane terminated polyolefin, a silane terminated poly-ether, and a silane terminated polyurethane. The stabilizer composition includes a component (B), which is a polymeric sterically hindered amine, and a component (C), which is a specific sterically hindered phenol.

The present invention pertains to a stabilized hot melt adhesive containing a) one or more hot melt adhesive materials and b) a stabilizer composition. The one or more hot melt adhesive materials a) include a polyolefin, a styrene-isoprene-styrene block co-polymer, a styrene-butadiene-styrene block co-polymer, a polyacrylate, an acryl-copolymer, an ethylene vinyl acetate, a polyamide, a polyester, a polyurethane, a polyimide, a silane terminated polyolefin, a silane terminated poly-ether, and a silane terminated polyurethane. The stabilizer composition includes a component (B), which is a polymeric sterically hindered amine, and a component (C), which is a specific sterically hindered phenol.