Patent classifications
C09J163/00
Eco-friendly adhesive coating agent composition for steel pipe using intermediate for structural adhesive
Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.
Eco-friendly adhesive coating agent composition for steel pipe using intermediate for structural adhesive
Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.
ROOM TEMPERATURE IONIC LIQUID CURING AGENT
Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compound represented by formula (I):
##STR00001##
wherein x, y, and z are integers of 2 and 3, m and n and integers of 1-3; and (b) an organic acid having pKa (the negative of the logarithm of the acid dissociation constant) less than 6. The liquid salt is a stable liquid at a temperature greater than 15° C. Curable epoxy-based compositions including the curing agent and articles formed by the curable epoxy-based compositions are also disclosed.
ROOM TEMPERATURE IONIC LIQUID CURING AGENT
Epoxy curing agents are disclosed having an epoxy curing agent comprising at least one room temperature ionic liquid salt, the room temperature ionic liquid salt being a reaction product of (a) at least one polyalkylene polyamine compound represented by formula (I):
##STR00001##
wherein x, y, and z are integers of 2 and 3, m and n and integers of 1-3; and (b) an organic acid having pKa (the negative of the logarithm of the acid dissociation constant) less than 6. The liquid salt is a stable liquid at a temperature greater than 15° C. Curable epoxy-based compositions including the curing agent and articles formed by the curable epoxy-based compositions are also disclosed.
PHOTONIC SINTERED NANOINK, PHOTONIC SINTERING METHOD, AND CONDUCTIVE NANOSTRUCTURE
Provided is photo-sintering nano ink. The photo-sintering nano ink includes a photo-sintering precursor including a conductive nano particle and an oxide film surrounding the conductive nano particle, polymer binder resin, and an adhesive.
Adhesive formulation
An adhesive composition including an epoxy-based adhesive polymer and a phosphorous element-containing compound; a process for making the adhesive composition; a process for increasing the corrosion resistance property of the adhesive composition; and a process for bonding a metal substrate with the adhesive composition to increase the corrosion resistance of the substrate by at least 40 percent.
Adhesive formulation
An adhesive composition including an epoxy-based adhesive polymer and a phosphorous element-containing compound; a process for making the adhesive composition; a process for increasing the corrosion resistance property of the adhesive composition; and a process for bonding a metal substrate with the adhesive composition to increase the corrosion resistance of the substrate by at least 40 percent.
Adhesive formulation
An adhesive composition including an epoxy-based adhesive polymer and a phosphorous element-containing compound; a process for making the adhesive composition; a process for increasing the corrosion resistance property of the adhesive composition; and a process for bonding a metal substrate with the adhesive composition to increase the corrosion resistance of the substrate by at least 40 percent.
Adhesive for endoscope, cured product, endoscope, and method for producing endoscope
Provided are an adhesive for an endoscope, a cured product thereof, an endoscope produced using the adhesive for an endoscope, and a method for producing the endoscope. The adhesive for an endoscope is a two-component adhesive for an endoscope. The two-component adhesive has a base and a curing agent. The base includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. The curing agent includes at least one specific polyamine compound (B). The adhesive for an endoscope is used to fix at least one of a metal member or a glass member constituting the endoscope.
Adhesive for endoscope, cured product, endoscope, and method for producing endoscope
Provided are an adhesive for an endoscope, a cured product thereof, an endoscope produced using the adhesive for an endoscope, and a method for producing the endoscope. The adhesive for an endoscope is a two-component adhesive for an endoscope. The two-component adhesive has a base and a curing agent. The base includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. The curing agent includes at least one specific polyamine compound (B). The adhesive for an endoscope is used to fix at least one of a metal member or a glass member constituting the endoscope.