The object of the present invention is to provide an adhesive composition that has a low toxicity, is curable at a low temperature, and is capable of forming a cured product having high heat resistance. The present invention relates to a dual-curable adhesive composition comprising: (a1) an oxetane compound, (a2) an alicyclic epoxy compound, (a3) an aromatic glycidyl ether-based epoxy compound, (b) a photocationic polymerization initiator, and (c) a thermal cationic polymerization initiator comprising a tetrakis(pentafluorophenyl)borate compound, wherein the amount of the component (a1) is 20 to 95 parts by mass, the amount of the component (a2) is 3 to 55 parts by mass, and the amount of the component (a3) is 3 to 45 parts by mass, each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).

The object of the present invention is to provide an adhesive composition that has a low toxicity, is curable at a low temperature, and is capable of forming a cured product having high heat resistance. The present invention relates to a dual-curable adhesive composition comprising: (a1) an oxetane compound, (a2) an alicyclic epoxy compound, (a3) an aromatic glycidyl ether-based epoxy compound, (b) a photocationic polymerization initiator, and (c) a thermal cationic polymerization initiator comprising a tetrakis(pentafluorophenyl)borate compound, wherein the amount of the component (a1) is 20 to 95 parts by mass, the amount of the component (a2) is 3 to 55 parts by mass, and the amount of the component (a3) is 3 to 45 parts by mass, each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).

The object of the present invention is to provide an adhesive composition that has a low toxicity, is curable at a low temperature, and is capable of forming a cured product having high heat resistance. The present invention relates to a dual-curable adhesive composition comprising: (a1) an oxetane compound, (a2) an alicyclic epoxy compound, (a3) an aromatic glycidyl ether-based epoxy compound, (b) a photocationic polymerization initiator, and (c) a thermal cationic polymerization initiator comprising a tetrakis(pentafluorophenyl)borate compound, wherein the amount of the component (a1) is 20 to 95 parts by mass, the amount of the component (a2) is 3 to 55 parts by mass, and the amount of the component (a3) is 3 to 45 parts by mass, each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

Provided are two-part curable adhesives that can be suitable for use in industrial bonding applications, including aero-space and automotive bonding. The adhesives include a first part that contains an epoxy resin and a first oligomeric toughener. The adhesives further include a second part comprising a curative that is reactive with the epoxy resin at ambient conditions and a second oligomeric toughener. The first and second oligomeric tougheners are immiscible with each other at ambient conditions. Advantageously, the adhesives when cured can simultaneously display both high shear strength and high peel performance at elevated temperatures.

Provided are two-part curable adhesives that can be suitable for use in industrial bonding applications, including aero-space and automotive bonding. The adhesives include a first part that contains an epoxy resin and a first oligomeric toughener. The adhesives further include a second part comprising a curative that is reactive with the epoxy resin at ambient conditions and a second oligomeric toughener. The first and second oligomeric tougheners are immiscible with each other at ambient conditions. Advantageously, the adhesives when cured can simultaneously display both high shear strength and high peel performance at elevated temperatures.

Provided are two-part curable adhesives that can be suitable for use in industrial bonding applications, including aero-space and automotive bonding. The adhesives include a first part that contains an epoxy resin and a first oligomeric toughener. The adhesives further include a second part comprising a curative that is reactive with the epoxy resin at ambient conditions and a second oligomeric toughener. The first and second oligomeric tougheners are immiscible with each other at ambient conditions. Advantageously, the adhesives when cured can simultaneously display both high shear strength and high peel performance at elevated temperatures.

According to an example aspect of the present invention, there is provided a composition comprising colloidal lignin particles and an epoxy compound.

According to an example aspect of the present invention, there is provided a composition comprising colloidal lignin particles and an epoxy compound.