A nail sticker, a composition for the nail sticker and a method for preparing the composition are disclosed. Raw materials of the composition include a sizing material, which is made of the following raw materials in parts by weight: 45-85 parts of a UV thermosetting resin, 2-9 parts of a photoinitiator, 1.5-2 parts of a curing agent, 0.1-1 part of a thermal promoter, and 0.1-1 part of a leveling agent. The synchronization of the release of essential oil molecules with light/thermal curing promotes the essential oil molecules to be diffused to the interior of the sizing material more uniformly in a wider range, and during the curing and film forming of the nail sticker, an aroma spreads as tantalizing as that of baked food.

In order to provide an inkjet head using an adhesive containing an epoxy resin as a main agent and an imidazole-based curing agent as a curing agent, capable of securing a time for joining work before curing, and having excellent long-term reliability, and a production method for the inkjet head, constituent members are bonded to each other by an adhesive containing at least an epoxy resin as a main agent, a microencapsulated imidazole-based curing agent as a curing agent, and an alcohol that dissolves the microcapsules at a low temperature, and preferably, a residue of the microcapsules dissolved by the alcohol is dispersed in the cured epoxy resin.

An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.

An expandable structural adhesive film for bonding metal parts. The adhesive film comprises at least one first epoxy compound; at least one epoxy curing agent; at least one blowing agent; at least one film-forming agent; and at least one impact modifier. The structural adhesive film exhibits an elongation at break of at least 300% according to tensile test DIN EN ISO 527 and a free expansion rate according to EN 2667-3 of at least 45%.

An expandable structural adhesive film for bonding metal parts. The adhesive film comprises at least one first epoxy compound; at least one epoxy curing agent; at least one blowing agent; at least one film-forming agent; and at least one impact modifier. The structural adhesive film exhibits an elongation at break of at least 300% according to tensile test DIN EN ISO 527 and a free expansion rate according to EN 2667-3 of at least 45%.

The invention relates to a potting paste composition for honeycomb reinforcement having improved fire retardancy characteristics. The potting paste composition comprises (a) a curable polymer; (b) a curing agent for the curable polymer; (c) a fire retardant comprising an ammonium polyphosphate in combination with an ingredient selected from the group consisting of metal hydroxides, expandable graphites, liquid phosphate esters, phosphorous organic compounds or salts thereof, and zeolites; and(d) a filler selected from the group consisting of polymeric microspheres, hollow glass microspheres, and thixotropic fillers; wherein the potting paste has an uncured density determined by the method according to EN ISO 1183 of not more than 0.7100 g/cm.sup.3, preferably of at most 0.680 g/cm.sup.3, more preferably of at most 0.673 g/cm.sup.3, still more preferably of at most 0.660 g/cm.sup.3, even more preferably of at most 0.658 g/cm.sup.3, yet more preferably of at most 0.653 g/cm.sup.3 and in particular of at most 0.620 g/cm.sup.3; and wherein the total content of the fire retardant is at least 5.0 wt.-%, preferably at least 10 wt.-%, more preferably at least 15 wt.-%, relative to the total weight of the potting paste composition.

The invention relates to a potting paste composition for honeycomb reinforcement having improved fire retardancy characteristics. The potting paste composition comprises (a) a curable polymer; (b) a curing agent for the curable polymer; (c) a fire retardant comprising an ammonium polyphosphate in combination with an ingredient selected from the group consisting of metal hydroxides, expandable graphites, liquid phosphate esters, phosphorous organic compounds or salts thereof, and zeolites; and(d) a filler selected from the group consisting of polymeric microspheres, hollow glass microspheres, and thixotropic fillers; wherein the potting paste has an uncured density determined by the method according to EN ISO 1183 of not more than 0.7100 g/cm.sup.3, preferably of at most 0.680 g/cm.sup.3, more preferably of at most 0.673 g/cm.sup.3, still more preferably of at most 0.660 g/cm.sup.3, even more preferably of at most 0.658 g/cm.sup.3, yet more preferably of at most 0.653 g/cm.sup.3 and in particular of at most 0.620 g/cm.sup.3; and wherein the total content of the fire retardant is at least 5.0 wt.-%, preferably at least 10 wt.-%, more preferably at least 15 wt.-%, relative to the total weight of the potting paste composition.

The present disclosure relates to a method for manufacturing a semiconductor package including vacuum-laminating a non-conductive film on a substrate on which a plurality of through silicon vias are provided and bump electrodes are formed, and then performing UV irradiation, wherein an increase in melt viscosity before and after UV irradiation can be adjusted to 30% or less, whereby a bonding can be performed without voids during thermo-compression bonding, and resin-insertion phenomenon between solders can be prevented, fillets can be minimized and reliability can be improved.

Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a compatibilizer which has at least one silane group and at least one epoxy terminal group. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.

Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a compatibilizer which has at least one silane group and at least one epoxy terminal group. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.