C09J169/00

High molecular weight polymers from waste raw materials

A polyether carbonate polyol with a nominal functionality of 3 or more includes an equivalent molecular weight between 20,000 and 500,000 Da, and content of between 0.5 wt % and 35 wt % of CO.sub.2 based on the total weight of the polyether carbonate polyol. The polyether carbonate polyol has adhesive and impact modifying properties.

High molecular weight polymers from waste raw materials

A polyether carbonate polyol with a nominal functionality of 3 or more includes an equivalent molecular weight between 20,000 and 500,000 Da, and content of between 0.5 wt % and 35 wt % of CO.sub.2 based on the total weight of the polyether carbonate polyol. The polyether carbonate polyol has adhesive and impact modifying properties.

Laminate and circuit board
10849231 · 2020-11-24 · ·

Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85 C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85 C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.

Laminate and circuit board
10849231 · 2020-11-24 · ·

Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85 C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85 C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.

NANOPARTICLE CONTAINING COMPOSITIONS

Flame retardant compositions, blends and articles include phosphonate polymers, nanoparticles and optionally dispersing agents. A method for preparing such retardant composition, blends, and articles is also presented herein.

NANOPARTICLE CONTAINING COMPOSITIONS

Flame retardant compositions, blends and articles include phosphonate polymers, nanoparticles and optionally dispersing agents. A method for preparing such retardant composition, blends, and articles is also presented herein.

CURABLE RESIN COMPOSITION AND ELETRICAL COMPONENT USING THE SAME
20200291170 · 2020-09-17 ·

A curable resin composition comprises a (meth)acrylic polyol, a polycarbonate-based polyol, and a polyisocyanate. The (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of 70 C. or more and 40 C. or less, and a number average molecular weight of 500 or more and 20000 or less, and which is liquid at 25 C. An electrical component (1) comprises a sealing material (2) including a cured product of the curable resin composition.

PRESSURE-SENSITIVE ADHESIVE
20200291270 · 2020-09-17 · ·

Pressure-sensitive adhesives, adhesive tapes, and methods enable high bond strengths on non-polar or rough substrates. The pressure-sensitive adhesives and methods comprise (a) at least one poly(meth)acrylate, (b) at least one resin A selected from colophony resins and terpene-phenolic resins, (c) at least one hydrocarbon resin B1 having a softening point of greater than 50 C., and (d) at least one hydrocarbon resin B2 having a softening point of less than or equal to 25 C. The adhesive tapes comprise one or more layers of the pressure-sensitive adhesives, and the methods may produce adhesive bonds on substrates with low surface energy and/or on substrates with a mean roughness of at least 5 m.

PRESSURE-SENSITIVE ADHESIVE
20200291270 · 2020-09-17 · ·

Pressure-sensitive adhesives, adhesive tapes, and methods enable high bond strengths on non-polar or rough substrates. The pressure-sensitive adhesives and methods comprise (a) at least one poly(meth)acrylate, (b) at least one resin A selected from colophony resins and terpene-phenolic resins, (c) at least one hydrocarbon resin B1 having a softening point of greater than 50 C., and (d) at least one hydrocarbon resin B2 having a softening point of less than or equal to 25 C. The adhesive tapes comprise one or more layers of the pressure-sensitive adhesives, and the methods may produce adhesive bonds on substrates with low surface energy and/or on substrates with a mean roughness of at least 5 m.

SILICONE CARBONATE POLYMERS AS RELEASE LAYERS FOR PRESSURE SENSITIVE ADHESIVE CONTAINING ARTICLES

The disclosure relates to articles comprising a substrate, a pressure sensitive adhesive, and a release layer, wherein the release layer comprises at least one silicone carbonate polymer.