The invention relates provides synthetic medical adhesives which exploit plant derivatives to form covalent bonds with amines and thiols on tissue surfaces.

The invention relates provides synthetic medical adhesives which exploit plant derivatives to form covalent bonds with amines and thiols on tissue surfaces.

An object of this invention is to find a method for introducing a functional group into an aliphatic polycarbonate without impairing the excellent thermal decomposition property of the aliphatic polycarbonate. An aliphatic polycarbonate comprising a constituent unit represented by formula (1): ##STR00001##
wherein R.sup.1, R.sup.2, and R.sup.3 are identical or different, and each represents a hydrogen atom, a C.sub.1-10 alkyl group optionally substituted with one or more substituents, or a C.sub.6-20 aryl group optionally substituted with one or more substituents, wherein two groups from among R.sup.1 to R.sup.3, taken together with the carbon atom or carbon atoms to which these groups are attached, may form a substituted or unsubstituted, saturated or unsaturated 3- to 10-membered aliphatic ring; and X represents a divalent group containing one or more heteroatoms or an alkylene group having 3 or more carbon atoms, and
a constituent unit represented by formula (2): ##STR00002##
wherein R.sup.4, R.sup.5, R.sup.6, and R.sup.7 are identical or different, and each represents a hydrogen atom, a C.sub.1-10 alkyl group optionally substituted with one or more substituents, or a C.sub.6-20 aryl group optionally substituted with one or more substituents, wherein two groups from among R.sup.4 to R.sup.7, taken together with the carbon atom or carbon atoms to which these groups are attached, may form a substituted or unsubstituted, saturated or unsaturated 3- to 10-membered aliphatic ring, the content of the constituent unit represented by formula (1) being 0.1 mol % or more and 1.5 mol % or less, based on the total amount of the constituent units of formula (1) and formula (2).

An object of this invention is to find a method for introducing a functional group into an aliphatic polycarbonate without impairing the excellent thermal decomposition property of the aliphatic polycarbonate. An aliphatic polycarbonate comprising a constituent unit represented by formula (1): ##STR00001##
wherein R.sup.1, R.sup.2, and R.sup.3 are identical or different, and each represents a hydrogen atom, a C.sub.1-10 alkyl group optionally substituted with one or more substituents, or a C.sub.6-20 aryl group optionally substituted with one or more substituents, wherein two groups from among R.sup.1 to R.sup.3, taken together with the carbon atom or carbon atoms to which these groups are attached, may form a substituted or unsubstituted, saturated or unsaturated 3- to 10-membered aliphatic ring; and X represents a divalent group containing one or more heteroatoms or an alkylene group having 3 or more carbon atoms, and
a constituent unit represented by formula (2): ##STR00002##
wherein R.sup.4, R.sup.5, R.sup.6, and R.sup.7 are identical or different, and each represents a hydrogen atom, a C.sub.1-10 alkyl group optionally substituted with one or more substituents, or a C.sub.6-20 aryl group optionally substituted with one or more substituents, wherein two groups from among R.sup.4 to R.sup.7, taken together with the carbon atom or carbon atoms to which these groups are attached, may form a substituted or unsubstituted, saturated or unsaturated 3- to 10-membered aliphatic ring, the content of the constituent unit represented by formula (1) being 0.1 mol % or more and 1.5 mol % or less, based on the total amount of the constituent units of formula (1) and formula (2).

The present invention relates to a method for producing polyether carbonate polyols, the polyether carbonate polyols having electron-poor and electron-rich double bonds, said method preferably comprising the steps of (a) providing a suspending agent and/or an H-functional starter compound and a DMC catalyst, 03) adding at least one epoxide and (y) adding carbon dioxide, an epoxide that does not contain an unsaturated group, and at least two unsaturated compounds, the unsaturated compounds in method step (y) being selected from the group comprising unsaturated epoxides and unsaturated cyclic anhydrides, and one of the unsaturated compounds having an electron-rich double bond and one of the unsaturated compounds having an electron-poor double bond. The invention also relates to the crosslinking of polyether carbonate polyols, the polyether carbonate polyols having electronpoor and electron-rich double bonds, and to the crosslinked polyether carbonates obtainable therefrom.

The present invention relates to a method for producing polyether carbonate polyols, the polyether carbonate polyols having electron-poor and electron-rich double bonds, said method preferably comprising the steps of (a) providing a suspending agent and/or an H-functional starter compound and a DMC catalyst, 03) adding at least one epoxide and (y) adding carbon dioxide, an epoxide that does not contain an unsaturated group, and at least two unsaturated compounds, the unsaturated compounds in method step (y) being selected from the group comprising unsaturated epoxides and unsaturated cyclic anhydrides, and one of the unsaturated compounds having an electron-rich double bond and one of the unsaturated compounds having an electron-poor double bond. The invention also relates to the crosslinking of polyether carbonate polyols, the polyether carbonate polyols having electronpoor and electron-rich double bonds, and to the crosslinked polyether carbonates obtainable therefrom.

Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.

A pressure-sensitive adhesive including an aliphatic polycarbonate as an adhesive component, wherein the aliphatic polycarbonate has no carboxylic acid ester bond or urethane bond in the main chain thereof; and a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer obtained by using the pressure-sensitive adhesive.

A pressure-sensitive adhesive including an aliphatic polycarbonate as an adhesive component, wherein the aliphatic polycarbonate has no carboxylic acid ester bond or urethane bond in the main chain thereof; and a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer obtained by using the pressure-sensitive adhesive.

A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.