The invention relates to a cationically curable composition with at least one cationically polymerizable component, a first photoinitiator releasing an acid when irradiated with actinic radiation of a first wavelength λ.sub.1, and a second photoinitiator releasing an acid when irradiated with actinic radiation of a second wavelength λ.sub.2, wherein the second wavelength λ.sub.2 is shorter than the first wavelength λ.sub.1, and wherein the second photoinitiator, after irradiation of the composition with actinic radiation of the first wavelength λ.sub.1, shows an absorption of actinic radiation of the second wavelength λ.sub.2 in the composition that is sufficient to activate the second photoinitiator and fix the composition. Furthermore, a method is described for the joining, casting, molding, sealing and/or coating of substrates using the cationically curable composition.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

Embodiments of the present disclosure provide for transient adhesive polymers, methods of making transient adhesive polymers, structures including the transient adhesive polymer attaching two portions of the structure to one another, and the like.

Embodiments of the present disclosure provide for transient adhesive polymers, methods of making transient adhesive polymers, structures including the transient adhesive polymer attaching two portions of the structure to one another, and the like.

Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 μm, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m.Math.K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m.Math.K or higher.

Provided are a film-like adhesive that can prevent the back surface of a semiconductor chip, the front surface of a substrate, or the front surface of a heat sink from being partially fractured by a filler; and a method for producing a semiconductor package using the film-like adhesive. The film-like adhesive includes an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and a heat-conductive filler material (D), in which the heat-conductive filler (D) has an average particle size of 0.1 to 10.0 μm, a compression ratio at break in a microcompression test of 5 to 50% of the average particle size of the sample, a fracture strength in a microcompression test of 0.01 to 2.0 GPa, and a thermal conductivity of 30 W/m.Math.K or higher, the content of component (D) is 10 to 70 vol % with respect to the total amount of the components (A) to (D), and the thermal conductivity after thermal curing is 1.0 W/m.Math.K or higher.

A coated polymer film, such as a coated polyester film, is disclosed. In one embodiment, the coated film may be used as a substrate for digital printing. In one embodiment, the coating contains an anionic anti-static agent comprising a sulphonated copolyester resin. In an alternative embodiment, the coating contains an anti-static agent comprising an organometallic, such as an organo zirconate, in combination with metal oxide particles. The metal oxide particles may comprise nanoparticles. In one embodiment, the coating can further contain a print enhancing agent and an adhesion promoter.

The invention provides a unique thermoset viscoelastomeric reaction product and a container combination comprised of the supportive base equipped with a thermoset viscoelastomer reaction product possessing unexpectedly superior adhesive and cohesive efficacy rendering it especially useful as an adhesive insert in a container combination. The thermoset insert bonds to any suitable supportive structure. The unique viscoelastomeric reaction product inserts adhesively immobilize items placed thereupon and adhesively or permanently bonds to most conventional containers. The tenacious cohesive and adhesive features of the insert allows for inverted stowage of stowed items. Due to the confining adhesive and cohesive attributes of the insert, structural supports of a flexible or solid base without a conventional confining structure provide a unique container combination for the stowed items. Containers equipped with the unique insert also surprisingly provide an aseptic environment especially useful for hygienic applications.

The invention provides a unique thermoset viscoelastomeric reaction product and a container combination comprised of the supportive base equipped with a thermoset viscoelastomer reaction product possessing unexpectedly superior adhesive and cohesive efficacy rendering it especially useful as an adhesive insert in a container combination. The thermoset insert bonds to any suitable supportive structure. The unique viscoelastomeric reaction product inserts adhesively immobilize items placed thereupon and adhesively or permanently bonds to most conventional containers. The tenacious cohesive and adhesive features of the insert allows for inverted stowage of stowed items. Due to the confining adhesive and cohesive attributes of the insert, structural supports of a flexible or solid base without a conventional confining structure provide a unique container combination for the stowed items. Containers equipped with the unique insert also surprisingly provide an aseptic environment especially useful for hygienic applications.

An adhesive composition, including at least polymer containing silane groups, between 15 and 35 wt.-% of at least one polymeric plasiticzer, between 0.5 and 2.5 wt.-% of at least one monomeric or oligomeric aminofunctional alkoxysilane S1 with a nitrogen content of between 4.5 and 14.5 wt.-%, and between 0.5 and 2.5 wt.-% of at least one oligomeric aminofunctional alkoxysilane S2 with a nitrogen content of between 15 and 20 wt.-%. The adhesive composition is particularly suitable to seal or bond thermoplastic substrates, such as polyolefins or bituminous materials, and shows fast adhesion build-up and low volatile organic carbon (VOC).