A process of forming a lactide copolymer includes forming a dimethylidene lactide molecule from an L-lactide molecule. The process also includes forming a functionalized lactide monomer from the dimethylidene lactide molecule. The process includes forming a mixture that includes the functionalized lactide monomer and a bisphenol A (BPA) monomer or a BPA-derived monomer. The process further includes polymerizing the mixture to form a lactide copolymer.

A process of forming a lactide copolymer includes forming a dimethylidene lactide molecule from an L-lactide molecule. The process also includes forming a functionalized lactide monomer from the dimethylidene lactide molecule. The process includes forming a mixture that includes the functionalized lactide monomer and a bisphenol A (BPA) monomer or a BPA-derived monomer. The process further includes polymerizing the mixture to form a lactide copolymer.

Provided is a curable compound product having excellent storage stability and moldability and by which a cured product having ultra-high heat resistance can be formed. The curable compound product according to the present disclosure has the following characteristics (a) to (g): (a) A number average molecular weight (calibrated with polystyrene standard) is from 1000 to 15000. (b) A proportion of a structure derived from an aromatic ring in a total amount of the curable compound product is 50 wt. % or greater. (c) Solvent solubility at 23 C. is 1 g/100 g or greater. (d) The glass transition temperature is from 80 to 230 C. (e) A viscosity (.sub.0) of a 20 wt. % NMP solution obtained by subjecting the curable compound product to a reduced-pressure drying process and then dissolving the reduced-pressure-dried curable compound product in NMP, and a viscosity (.sub.10) of the 20 wt. % NMP solution after being left to stand for 10 days in a desiccator maintained at 23 C. satisfy the Equation (E): .sub.10/.sub.0<2(E). (f) A molecular skeleton has a sulfonyl group. (g) An exothermic onset temperature is 220 C. or higher.

Provided is a curable compound product having excellent storage stability and moldability and by which a cured product having ultra-high heat resistance can be formed. The curable compound product according to the present disclosure has the following characteristics (a) to (g): (a) A number average molecular weight (calibrated with polystyrene standard) is from 1000 to 15000. (b) A proportion of a structure derived from an aromatic ring in a total amount of the curable compound product is 50 wt. % or greater. (c) Solvent solubility at 23 C. is 1 g/100 g or greater. (d) The glass transition temperature is from 80 to 230 C. (e) A viscosity (.sub.0) of a 20 wt. % NMP solution obtained by subjecting the curable compound product to a reduced-pressure drying process and then dissolving the reduced-pressure-dried curable compound product in NMP, and a viscosity (.sub.10) of the 20 wt. % NMP solution after being left to stand for 10 days in a desiccator maintained at 23 C. satisfy the Equation (E): .sub.10/.sub.0<2(E). (f) A molecular skeleton has a sulfonyl group. (g) An exothermic onset temperature is 220 C. or higher.

The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing. The thermally conductive moisture-curable resin composition contains the following components (A) to (C): component (A): an organic polymer containing two or more hydrolyzable silyl groups; component (B): a thermally conductive filler; and component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.

The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing. The thermally conductive moisture-curable resin composition contains the following components (A) to (C): component (A): an organic polymer containing two or more hydrolyzable silyl groups; component (B): a thermally conductive filler; and component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.

Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.