C09J175/00

DIPPING BATH COMPOSITIONS FOR TREATING REINFORCING INSERTS
20200024415 · 2020-01-23 · ·

The present invention relates to an aqueous, solids-containing dipping bath composition for treating reinforcing inserts for rubber products comprising the following components or consisting of these components, (A) at least one blocked MDI mixture, the MDI mixture comprising MDI oligomers of formula (I), n being a whole number from 1 to 8, and MDI monomers; (B) at least one resorcinol-formaldehyde latex; and (C) possibly at least one additive, wherein the dipping bath composition is essentially free of epoxides.

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Low-Temperature Curing Adhesive Compositions

Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.

Low-Temperature Curing Adhesive Compositions

Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.

METHOD OF MANUFACTURING SELF-ADHESIVE POLYURETHANE SUBSTRATES VIA SELECTIVE PHOTO-POLYMERIZATION
20240052218 · 2024-02-15 ·

Provided is a method of manufacturing self-adhesive polyurethanes using selective photo-polymerization. The method of manufacturing self-adhesive polyurethanes using photo-polymerization relates to a method for manufacturing photo-polymerized self-adhesive polyurethane substrates applicable to biocompatible epidermal soft sensors and attachable epidermal thermal heaters without particularly adding an adhesive additive.

METHOD OF MANUFACTURING SELF-ADHESIVE POLYURETHANE SUBSTRATES VIA SELECTIVE PHOTO-POLYMERIZATION
20240052218 · 2024-02-15 ·

Provided is a method of manufacturing self-adhesive polyurethanes using selective photo-polymerization. The method of manufacturing self-adhesive polyurethanes using photo-polymerization relates to a method for manufacturing photo-polymerized self-adhesive polyurethane substrates applicable to biocompatible epidermal soft sensors and attachable epidermal thermal heaters without particularly adding an adhesive additive.

ADHESIVE COMPOSITIONS BASED ON GRAFTED RESINS

A curable adhesive that is particularly well suited for use in an injection or compression molding operation. The adhesive is based on polymeric resins having carboxylic acid and acrylate ester functionality, such as grafted phenoxy resin, and further constituents such as organic carbonates, blocked isocyanates, catalysts, maleimide compounds, hydride sources, and a carrier fluid. The curable adhesives are particularly well suited for bonding liquid injectable substrates such as liquid silicone rubber, or polyamides to rigid substrates, such as aluminum, stainless steel, or glass.

ADHESIVE COMPOSITIONS BASED ON GRAFTED RESINS

A curable adhesive that is particularly well suited for use in an injection or compression molding operation. The adhesive is based on polymeric resins having carboxylic acid and acrylate ester functionality, such as grafted phenoxy resin, and further constituents such as organic carbonates, blocked isocyanates, catalysts, maleimide compounds, hydride sources, and a carrier fluid. The curable adhesives are particularly well suited for bonding liquid injectable substrates such as liquid silicone rubber, or polyamides to rigid substrates, such as aluminum, stainless steel, or glass.

LOW-TEMPERATURE CURING COATING COMPOSITIONS

The present invention is directed towards a coating composition comprising a film-forming polymer comprising active hydrogen-containing functional groups; a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester or thioester; and a curing catalyst that does not contain tin, lead, iron, zinc or manganese. Also disclosed are coatings, coated substrates, and methods of coating a substrate.

LOW-TEMPERATURE CURING COATING COMPOSITIONS

The present invention is directed towards a coating composition comprising a film-forming polymer comprising active hydrogen-containing functional groups; a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester or thioester; and a curing catalyst that does not contain tin, lead, iron, zinc or manganese. Also disclosed are coatings, coated substrates, and methods of coating a substrate.

CURABLE COMPOSITION, CURED PRODUCT, AND ADHESIVE
20240132659 · 2024-04-25 · ·

A curable composition containing: a blocked isocyanate prepolymer containing a polyol compound, a polyisocyanate compound, a branching agent, and a blocking agent; an epoxy resin; and a curing agent and/or a curing accelerator, wherein the polyol compound is polytetramethylene glycol, the branching agent is a compound having at least three reactive functional groups capable of reacting with an isocyanate group, an amount by mole of the isocyanate group in the polyisocyanate compound is 2 mol or less relative to 1 mol of a total amount by mole of a hydroxy group in the polyol compound and the reactive functional groups capable of reacting with the isocyanate group in the branching agent, and an amount of the reactive functional groups in the branching agent is more than 50 mol % of the total amount of the hydroxy group in the polyol compound and the reactive functional groups in the branching agent.