Disclosed herein are improved methods for bonding textiles using an adhesive composition.

An adhesive layer can include a polymer blend of a first polymer and a second polymer. In an embodiment, the first polymer can be a modified fluoropolymer. In another embodiment, the second can be a non-fluorinated polymer. In a particular embodiment, the adhesive layer can include greater than 60 wt. % of the first polymer for the total weight of the polymer blend. A bearing can include the adhesive layer disposed over a substrate.

The invention relates to a fatty amide which is a di- or triamide based on a polyether diamine or triamine which can be used as organogelator and in particular as rheology additive. The invention also relates to a formulation composition using said fatty amide as rheology additive and to its use with this aim in coating, adhesive or PVC plastisol compositions and in particular transparent or non-transparent mastic compositions. said rheology additive has the advantage of not needing a specific activation process before use, in contrast to the other known fatty amide additives based on hydrogenated castor oil derivatives.

The invention relates to a fatty amide which is a di- or triamide based on a polyether diamine or triamine which can be used as organogelator and in particular as rheology additive. The invention also relates to a formulation composition using said fatty amide as rheology additive and to its use with this aim in coating, adhesive or PVC plastisol compositions and in particular transparent or non-transparent mastic compositions. said rheology additive has the advantage of not needing a specific activation process before use, in contrast to the other known fatty amide additives based on hydrogenated castor oil derivatives.

There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent adhesion in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a copolymer nylon powder.

The present disclosure relates to an adhesive comprising at least one of the following copolymer A: the copolymer A has at least one repeating unit carrying an amide group and a carboxyl and/or its ammonium salt and at least one other repeating unit different from the one carrying an amide group and a carboxyl and/or its ammonium salt. The present disclosure also relates to an artificial board formed of a lignocellulose material and the adhesive and a method for manufacturing the artificial board.

The present disclosure relates to an adhesive comprising at least one of the following copolymer A: the copolymer A has at least one repeating unit carrying an amide group and a carboxyl and/or its ammonium salt and at least one other repeating unit different from the one carrying an amide group and a carboxyl and/or its ammonium salt. The present disclosure also relates to an artificial board formed of a lignocellulose material and the adhesive and a method for manufacturing the artificial board.

The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.

The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.

The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.