Patent classifications
C09J177/00
Secondary battery and method for manufacturing the same
The embodiment of the present application relates to the field of Li-ion battery and, in particular, to a secondary battery. The secondary battery includes a cell, a safety component fixed on the cell and thermal conductive adhesive provided between the cell and the safety component, the thermal conductive adhesive contains at least one of hot melt adhesive, silica gel binder or epoxy resin binder, and thermal conductive filling material. The thermal conductive adhesive in the secondary battery performs good thermal conductivity and adhering property, which can stably adhere the safety component with the cell, meanwhile transferring, via the thermal conductive adhesive, heat of the cell to the safety component rapidly, so that the safety component cuts off the circuit to protect the cell during overcharge, thereby avoid situations that the thermal conductive adhesive is separated from the cell due to cell inflation and deformation.
DIELECTRIC-HEATING BONDING FILM AND JOINING METHOD USING DIELECTRIC-HEATING BONDING FILM
A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 m, a thickness of the dielectric welding film ranging from 10 to 2,000 m. The method uses the dielectric welding film.
Systems and Methods for Unifying Assemblies that Share Common Taggant Identifier Data
The present invention describes systems and methods for embedding authentication data into a quality control tamper evidence adhesive sealant material used to mark a system of parts and assemblies, creating a unified and traceable layer of security data to identify unauthorized modifications to manufactured systems.
Systems and Methods for Unifying Assemblies that Share Common Taggant Identifier Data
The present invention describes systems and methods for embedding authentication data into a quality control tamper evidence adhesive sealant material used to mark a system of parts and assemblies, creating a unified and traceable layer of security data to identify unauthorized modifications to manufactured systems.
Adhesives
The invention relates to biomimetic adhesive compositions emulating mussel adhesive proteins, wherein multiple chains of a copolymer are interlinked via specific hydrogen bonds and/or ligand-metal-ligand bonds, which serve as sacrificial breakable bonds upon mechanical stress and thereby effectively dissipate the mechanical energy. Accordingly, toughened adhesive compositions with improved ductility and strength may be obtained.
Adhesives
The invention relates to biomimetic adhesive compositions emulating mussel adhesive proteins, wherein multiple chains of a copolymer are interlinked via specific hydrogen bonds and/or ligand-metal-ligand bonds, which serve as sacrificial breakable bonds upon mechanical stress and thereby effectively dissipate the mechanical energy. Accordingly, toughened adhesive compositions with improved ductility and strength may be obtained.
Process for concentrically bonding tubes using a hot melt adhesive
A tube used or medical or other purposes is concentrically bonded to an inner lining tube by sequentially inserting a core within the inner lining tube, creating an adhesive layer on the outer surface of the inner lining tube, inserting the inner lining tube and core into the lumen of the outer tube, and then activating the adhesive to bond the inner tune to the outer tube before removing the core.
DIELECTRIC-HEATING BONDING FILM AND BONDING METHOD USING DIELECTRIC-HEATING BONDING FILM
A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.
DIELECTRIC-HEATING BONDING FILM AND BONDING METHOD USING DIELECTRIC-HEATING BONDING FILM
A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.
DIELECTRIC-HEATING BONDING FILM AND BONDING METHOD USING DIELECTRIC-HEATING BONDING FILM
A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.