The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1; c) a curable monomer which is different from the cationically self-polymerizable monomer; and d) a curing initiator of the curable monomer which is initiated at a temperature T2 and which is different from the polymerization initiator of the cationically self-polymerizable monomer; and e) a thixotropic agent. According to another aspect, the present disclosure is directed to a partially cured precursor of a structural adhesive composition. According to still another aspect, the present disclosure relates to a method of bonding two parts. In yet another aspect, the disclosure relates to the use of a curable precursor or a partially cured precursor as described above, for industrial applications, in particular for body-in-white bonding applications for the automotive industry.

The present disclosure is directed to peelable, heat-sealable lidding films for containers of diverse polymer compositions storing various products such as foodstuffs and pharmaceuticals. The lidding films disclosed herein can be heat-sealed to crystalline polyester trays (CPET), easily peeled, and contain improved antifogging performance by incorporating a non-migratory antifogging additive into the heat sealable layer of the film without deteriorating seal strengths.

The present disclosure is directed to peelable, heat-sealable lidding films for containers of diverse polymer compositions storing various products such as foodstuffs and pharmaceuticals. The lidding films disclosed herein can be heat-sealed to crystalline polyester trays (CPET), easily peeled, and contain improved antifogging performance by incorporating a non-migratory antifogging additive into the heat sealable layer of the film without deteriorating seal strengths.

The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.

The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.

Described is a process for producing adhesive-coated articles, wherein an aqueous dispersion adhesive composition comprising a dispersed adhesive polymer and a dissolved polyvinylpyrrolidone is applied at high web speed to a film substrate using a coating machine having at least one rotating roller and wherein the coated film substrate may optionally be bonded to a further substrate. Also described is the use of polyvinylpyrrolidone as a defoamer for aqueous dispersion adhesive compositions applied to a film substrate using a coating machine having a rapidly rotating roller.

Described is a process for producing adhesive-coated articles, wherein an aqueous dispersion adhesive composition comprising a dispersed adhesive polymer and a dissolved polyvinylpyrrolidone is applied at high web speed to a film substrate using a coating machine having at least one rotating roller and wherein the coated film substrate may optionally be bonded to a further substrate. Also described is the use of polyvinylpyrrolidone as a defoamer for aqueous dispersion adhesive compositions applied to a film substrate using a coating machine having a rapidly rotating roller.

A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.

Curable compositions, such as by way of exposure to radiation in the electromagnetic spectrum, for use as a primer composition for injection molding applications, are provided.

Curable compositions, such as by way of exposure to radiation in the electromagnetic spectrum, for use as a primer composition for injection molding applications, are provided.