The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer having no functional group which reacts with the moisture-curable component, and a water content of the base polymer after storage at 25° C. and 50% RH for 24 hours is 0.1% by weight or less, and wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer having no functional group which reacts with the moisture-curable component, and a water content of the base polymer after storage at 25° C. and 50% RH for 24 hours is 0.1% by weight or less, and wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

A hydrogel 1 having a laminate structure of layer A 10 and layer B 20, wherein layer A 10 contains a monomer-derived component, water, a humectant, a water-insoluble polymer having tackiness and an amphiphilic polymer, the water-insoluble polymer is contained in a proportion of 3 to 20 wt % based on a total amount of layer A, and the amphiphilic polymer is a polyvinyl alcohol having a saponification degree of 50 to 75% and is contained in a proportion of 0.05 to 5 wt % based on the total amount of layer A; layer B 20 contains a monomer-derived component, water and a humectant and is substantially free of a water-insoluble polymer having tackiness and a polyvinyl alcohol; and an amount of the water based on a total amount of layer B is the amount of water based on the total amount of layer A±10 wt %.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

An optical path control device can include a first substrate having a first electrode disposed thereon, a second substrate disposed on the first substrate and having a second electrode disposed thereon, and a light conversion layer disposed between the first substrate and the second substrate and including a partition portion and a containing portion including suspended particles, where the partition portion and the containing portion are alternately disposed. The optical path control device can further include an adhesive layer disposed between the first substrate and the light conversion layer, a sealing portion disposed between the first substrate and the second substrate and surrounding the light conversion layer, and a dam portion disposed between the first substrate and the second substrate and disposed on an outside of the sealing portion.

An optical path control device can include a first substrate having a first electrode disposed thereon, a second substrate disposed on the first substrate and having a second electrode disposed thereon, and a light conversion layer disposed between the first substrate and the second substrate and including a partition portion and a containing portion including suspended particles, where the partition portion and the containing portion are alternately disposed. The optical path control device can further include an adhesive layer disposed between the first substrate and the light conversion layer, a sealing portion disposed between the first substrate and the second substrate and surrounding the light conversion layer, and a dam portion disposed between the first substrate and the second substrate and disposed on an outside of the sealing portion.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.