Provided are a film which can be decorated even against a three-dimensional shape, is excellent in moldability during decoration (adhesion) on an adherend, is able to reduce concaves and convexes with a variety of sizes which the adherend surface has, and makes an appearance quality favorable; and a decorative molded product having the film. The film is a film including a layer containing a thermoplastic resin, wherein when a highest temperature of glass transition temperatures of the film is designated as Tg [+ C], a temperature T [° C.] at which an elongation at break is 50% or more exists in a range of Tg to (Tg+50 [° C.]), and when, with respect to concaves and convexes of an abrasive grain surface of a polyester film sheet having, as an abrasive grain, aluminum oxide having a grain size of 12 μm coated thereon, an amplitude relative to a spatial frequency f is designated as A.sub.1(f); with respect to concaves and convexes of a film surface when adhering the film to the abrasive grain surface at any temperature of the range of Tg to (Tg+50 [° C.]) and a pressure of 0.3 MPa, an amplitude relative to the spatial frequency f is designated as A.sub.2(f); and a ratio of A.sub.2(f) to A.sub.1(f) is designated as ϕ(f)=A.sub.2(f)/A.sub.1(f), a minimum value fc of spatial frequencies where ϕ(f) is 0.1 is 2.0 mm.sup.−1 or less.

To provide an adhesive suitable to bond a component of an electronic apparatus or an optical apparatus, as well as an electronic apparatus and an optical apparatus in which the adhesive is used. An adhesive according to an embodiment of the present technology includes a flexible adhesive material and a plurality of particles. The adhesive material is flexible. The plurality of particles is dispersed in the adhesive material, the plurality of particles being deformed under a low-rate load and not being deformed under a high-rate load.

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

The present invention provides a transparent electroconductive layer-equipped cover element having a pressure-sensitive adhesive sheet preliminarily laminated thereto, wherein the pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer in which a refractive index adjustment zone having a refractive index greater than that of a base pressure-sensitive adhesive material thereof is formed over a given range from a surface of the pressure-sensitive adhesive layer in a thickness direction thereof, whereby: in a lamination process of a customer which is a supply destination of the transparent electroconductive layer-equipped cover element, it becomes possible to eliminate a need to distinguish between obverse and reverse sides of the pressure-sensitive adhesive sheet itself; and, when the transparent electroconductive layer-equipped cover element is bonded to an optical element through the pressure-sensitive adhesive layer, it becomes possible to suppress internal reflection in a laminate formed of these optical elements.

The present invention provides a transparent electroconductive layer-equipped cover element having a pressure-sensitive adhesive sheet preliminarily laminated thereto, wherein the pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer in which a refractive index adjustment zone having a refractive index greater than that of a base pressure-sensitive adhesive material thereof is formed over a given range from a surface of the pressure-sensitive adhesive layer in a thickness direction thereof, whereby: in a lamination process of a customer which is a supply destination of the transparent electroconductive layer-equipped cover element, it becomes possible to eliminate a need to distinguish between obverse and reverse sides of the pressure-sensitive adhesive sheet itself; and, when the transparent electroconductive layer-equipped cover element is bonded to an optical element through the pressure-sensitive adhesive layer, it becomes possible to suppress internal reflection in a laminate formed of these optical elements.

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average, particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.

A bonded object manufacturing apparatus is for manufacturing a bonded object in which a first object and a second object, which is more flexible than the first object, are bonded by a bonding agent, viscosity of which is variable, and includes: a bonding agent supplier that supplies the bonding agent to a first or second bonding surfaces; a thickening unit that increases the viscosity of the bonding agent; and a loading unit that applies a load to and deforms the second object against the bonding agent that closely adheres to the first bonding surface and becomes harder than the second object. In a method for manufacturing a bonded object, the first and second bonding surfaces are brought close to each other to hold the bonding agent therebetween, the bonding agent closely adheres to a required portion of the first bonding surface, and the second object is loaded and deformed against the bonding agent that closely adheres to the first bonding surface and is harder than the second object.

Provided are a surface protection film which would stably display an image, and would stably attain a mirror state, and which would be stably operated without inhibiting display operability.

Disclosed is a surface protection film including a resin film and a pressure-sensitive adhesive layer, in which the relative permittivity of the resin film is of 1.0 to 5.0, the reflectance is set to a value within the range of 20% to 80%, and the transmittance for light is of 20% to 80%.