A laminate film (30) of the present invention includes a heat sealing layer (10) composed of a resin composition including, with respect to 20 to 95 parts by weight of a propylene-based polymer (A) having a melting point (Tm) of equal to or higher than 120 C. and equal to or lower than 170 C. as measured by differential scanning calorimetry (DSC), a total of 5 to 80 parts by weight of two or more kinds of copolymers selected from the group consisting of a propylene.1-butene copolymer (B) containing a unit derived from propylene in an amount of 51 to 95 mol % and a unit derived from 1-butene in an amount of 5 to 49 mol %, wherein the total of the unit derived from propylene and the unit derived from 1-butene is 100 mol %, a copolymer (C) of ethylene and an -olefin having 3 to 20 carbon atoms, and a copolymer (D) of 1-butene and an -olefin having 3 carbon atoms or 5 to 20 carbon atoms containing a constitutional unit derived from 1-butene in an amount of 50 to 99 mol % and a constitutional unit derived from an -olefin having 3 carbon atoms or 5 to 20 carbon atoms in an amount of 1 to 50 mol %, wherein the total of the unit derived from 1-butene and the unit derived from the -olefin is 100 mol %, wherein each of Component (B), Component (C), and Component (D) does not correspond to Component (A), and the total amount of Component (A), Component (B), Component (C), and Component (D) is 100 parts by weight, and a base layer (20), in which a surface of the heat sealing layer (10) opposite to the base layer (20) has a wet tension of 32 to 45 mN/m.

A curable high heat epoxy composition, comprising: 40 to 95 wt % of at least one high heat diepoxy compound of formulas (I) to (X) as provided herein; 1 to 40 wt % of an auxiliary polyepoxide; 0.01 to 12 wt % of a core-shell particle comprising an elastomer core and a rigid shell; and a hardener.

The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for electronic devices that require low water vapor transmission rate.

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

A synthetic polyisoprene latex containing synthetic polyisoprene, wherein the synthetic polyisoprene constituting the synthetic polyisoprene latex includes a low-molecular weight synthetic isoprene chain having a molecular weight of less than 1,000,000 at a content rate of 10 to 70% by weight and a high-molecular weight synthetic isoprene chain having a molecular weight of 1,000,000 or more at a content rate of 30 to 90% by weight. Also, a method for producing the synthetic polyisoprene latex, wherein the synthetic polyisoprene containing the low-molecular weight synthetic isoprene chain and the high-molecular weight synthetic isoprene chain is obtained by polymerizing a monomer containing isoprene in an organic solvent by use of an organic alkali metal catalyst.

The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

The invention relates to a vapor barrier which is self-adhesive on one side, comprising at least one moisture barrier layer, a carrier film and a first pressure-sensitive adhesive layer which is resistant to moisture, wherein a structured surface and/or a textile structure is present on the side of the carrier film opposite the first pressure-sensitive adhesive layer.

In an embodiment a solvent composition can comprise, based on the total volume of the solvent composition, 10 to 95 volume percent of a first solvent, wherein the first solvent has Hansen solubility parameters of: 15 MPa.sup.0.5.sub.D17 MPa.sup.0.5, 4.sub.P10.5 MPa.sup.0.5, and 7.sub.H10 MPa.sup.0.5; 5 to 95 volume percent of a second solvent, wherein the second solvent has Hansen solubility parameters of: 16 MPa.sup.0.5.sub.D17.5 MPa.sup.0.5, 0.sub.P3 MPa.sup.0.5, and 0.sub.H3 MPa.sup.0.5; and 0 to 85 volume percent parachlorobenzotrifluoride; wherein the amounts of the first solvent, the second solvent, and parachlorobenzotrifluoride sum to at least 85 volume percent. The first solvent can comprise methyl acetate, acetone, dimethyl carbonate, ethyl acetate, n-butylamine, propyl acetate, tetrahydrofuran, or a combination thereof. The second solvent can comprise cyclohexene, cyclohexane, cyclopentane, methylcyclohexane, or a combination thereof. The solvent compositions are particularly useful in an adhesive composition. An adhesive composition includes the solvent composition, a rubber, and a tackifying resin. A method of bonding two surfaces is also described.