Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same

Abstract

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Claims

1. A pressure-sensitive adhesive film satisfying Equation 1, comprising: a pressure-sensitive adhesive having a water vapor transmission rate of 50 g/m.sup.2.Math.day or less in a thickness direction, wherein the water vapor transmission rate is measured according to a specification of ASTM F1249:
X0.3 mm,[Equation 1] wherein X is a change in a creeping distance of a pressure-sensitive adhesive layer between 50 to 200 seconds when a base film, in which the pressure-sensitive adhesive layer comprising a crosslinked product of the pressure-sensitive adhesive is formed to have a thickness of 50 m on one surface thereof, is adhered to a glass plate having an adhesive area of 1 cm.sup.2, and aged for 24 hours, and then an 1 kg load is applied thereto at 80 C. for 1000 seconds, and wherein the pressure-sensitive adhesive film has a loss factor (tan ) of 0.05 to 0.25 at 80 C. and a frequency of 1 Hz.

2. The film according to claim 1, wherein the change in creeping distance represented by Equation 1 is 0.01 to 0.3 mm.

3. The film according to claim 1, which has a light transmittance of 85% or more with respect to a visible-ray region.

4. The film according to claim 1, which has a haze of 3% or less.

5. The film according to claim 1, wherein the pressure-sensitive adhesive comprises a pressure-sensitive adhesive composition having an encapsulating resin and an active energy ray-polymerizable compound.

6. The film according to claim 5, wherein the encapsulating resin is a copolymer of a diene and an olefin-based compound having one carbon-carbon double bond.

7. The film according to claim 5, wherein the active energy ray-polymerizable compound is a multifunctional acrylate.

8. The film according to claim 5, wherein the active energy ray-polymerizable compound satisfies Formula 1: ##STR00003## wherein R.sub.1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or more, and X is a residue derived from a linear, branched, or cyclic alkyl group having 3 to 30 carbon atoms.

9. The film according to claim 5, wherein the pressure-sensitive adhesive composition further comprises a tackifier.

10. The film according to claim 5, wherein the pressure-sensitive adhesive composition further comprises a radical initiator.

11. The film according to claim 1, wherein the pressure-sensitive adhesive comprises a moisture absorbent.

12. The film according to claim 1, which comprises a first layer having the pressure-sensitive adhesive and a second layer having a pressure-sensitive adhesive resin or an adhesive resin.

13. An organic electronic device, comprising: a substrate; an organic electronic element formed on the substrate; and the pressure-sensitive adhesive film according to claim 1 to encapsulate the organic electronic element.

14. A method of manufacturing an organic electronic device, comprising: applying the pressure-sensitive adhesive film of claim 1 to a substrate on which an organic electronic element is formed in order to cover the organic electronic element; and curing the pressure-sensitive adhesive film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIGS. 1 and 2 are cross-sectional views of pressure-sensitive adhesive films according to exemplary embodiments of the present invention; and

(2) FIG. 3 is a cross-sectional view of a product for encapsulating an organic electronic device according to an exemplary embodiment of the present invention.

DESCRIPTION OF REFERENCE NUMERALS

(3) 1, 2: pressure-sensitive adhesive film

(4) 11: pressure-sensitive adhesive

(5) 12: first film

(6) 21: second film

(7) 3: organic electronic device

(8) 31: substrate

(9) 32: organic electronic element

(10) 33: pressure-sensitive adhesive or encapsulating layer

(11) 34: cover substrate

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

(12) Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples, but the scope of the present invention is not limited to the following Examples.

EXAMPLE 1

(13) A coating solution was prepared by adding 90 g of a butyl rubber (LANXESS, BUTYL 301) as an encapsulating resin, 10 g of a hydrogenated DCPD-based tackifier resin (SU-90, Kolon) as a tackifier, 15 g of tricyclodecane dimethanol diacrylate (M262, Miwon) as an active energy ray-polymerizable compound, and 1 g of 2,2-dimethoxy-1,2-diphenylethane-1-one (Irgacure651, Ciba) as a radical initiator, and diluting the mixture in toluene to have a solid content of approximately 15 wt %.

(14) The prepared solution was coated on a released surface of release polyethyleneterephthalate (PET), and dried in an oven at 100 C. for 15 minutes, thereby manufacturing a pressure-sensitive adhesive film including a pressure-sensitive adhesive layer having a thickness of 50 m. Physical properties of the sample were measured after a UV ray was irradiated at 2 J/cm.sup.2 to the manufactured film.

EXAMPLE 2

(15) A pressure-sensitive adhesive film was manufactured by the same method as described in Example 1, except that CaO (Aldrich) was added as a moisture absorbent at 20 parts by weight relative to 100 parts by weight of a butyl rubber and a tackifier resin.

COMPARATIVE EXAMPLE 1

(16) A pressure-sensitive adhesive film was manufactured by the same method as described in Example 1, except that 15 g of tricyclodecane dimethanol diacrylate (M262, Miwon) and 1 g of 2,2-dimethoxy-1,2-diphenylethane-1-one (Irgacure651, Ciba) were not added and UV curing was not performed.

COMPARATIVE EXAMPLE 2

(17) A pressure-sensitive adhesive film was manufactured by the same method as described in Example 1, except that 15 g of fumed silica (R812, Evonik) was added instead of 15 g of tricyclodecane dimethanol diacrylate (M262, Miwon) and 1 g of 2,2-dimethoxy-1,2-diphenylethane-1-one (Irgacure651, Ciba).

COMPARATIVE EXAMPLE 3

(18) A coating solution (pressure-sensitive adhesive composition) was prepared by mixing 99 parts by weight of n-butyl acrylate and 1 part by weight of 2-hydroxyethyl methacrylate, and blending a multifunctional epoxy compound (trimethylolpropane triglycidylether), a cationic photoinitiator (triarylsulfonium hexafluoroantimonate), and -glycidoxypropyl trimethoxy silane to an acrylic pressure-sensitive adhesive having a molecular weight (Mw) of approximately 1,800,000, and diluting the resulting mixture in a suitable concentration.

(19) The prepared coating solution was coated on a released surface of release PET film in which releasing treatment was performed on one surface thereof, dried, and irradiated with a UV ray, thereby realizing a crosslinking structure. Therefore, a pressure-sensitive adhesive layer was formed to have a thickness of approximately 50 m.

(20) Hereinafter, physical properties of Examples and Comparative Examples were evaluated by the following methods.

(21) 1. Water Vapor Transmission Rate (WVTR)

(22) A resin composition was prepared by dissolving the resin used in Example or Comparative Example in a solvent. The resin composition was applied to a base film (release polyester film, RS-21G, SKC) having a thickness of 38 m. Subsequently, the composition was dried at 110 C. for 10 minutes, thereby forming a film-type layer having a thickness of 100 m. Afterward, the base film was peeled, and then a WVTR of the film-type layer was measured in a thickness direction, while the layer was maintained at 100 F. and a relative humidity of 100%. The WVTR was measured according to a specification of ASTM F1249.

(23) 2. Evaluation of Reliability

(24) The film manufactured in Example and Comparative Example was laminated on a barrier film (serving as a cover substrate), and a polarizing plate was laminated on the barrier film. The laminated set was laminated on a glass, and compressed with a pressure and heat using an autoclave at 50 C. and 5 atm. A polarizing plate was laminated again on the barrier film, and the sample was maintained in an 80 C. chamber for approximately 500 hours to observe whether lifting or bubbles were generated at an interface between the glass substrate and the pressure-sensitive adhesive layer. When being viewed with the naked eye, at the interface between the glass substrate and the pressure-sensitive adhesive layer, if at least one lifting or bubble was generated, it was represented as X, and if neither lifting nor bubble was generated, it was represented as O.

(25) 3. High Temperature Retention (Creeping Distance)

(26) A pressure-sensitive adhesive layer having a thickness of 50 m, which included the pressure-sensitive adhesive composition according to Example and Comparative Example, was adhered to a base film, a pressure-sensitive adhesive surface was adhered to a glass plate to have a size of 1 cm1 cm, and maintained at room temperature for 24 hours, and then a change in creeping distance of the pressure-sensitive adhesive layer was measured between 50 to 200 seconds when an 1 kg/f load was applied at 80 C. for 1000 seconds.

(27) TABLE-US-00001 TABLE 1 WVTR Retention at 80 C., Reliability at (g/m.sup.2 .Math. day) Creeping distance (mm) 80 C. Example 1 4 0.1 Example 2 6 0.1 Comparative 5 10< X Example 1 Comparative 4 10< X Example 2 Comparative >500 0.1 Example 3

(28) In Comparative Examples 1 and 2, a pressure-sensitive adhesive layer was greatly dislocated due to considerably low retention at a high temperature, and therefore the sample was detached.