A self-adhering roofing membrane may include a polymeric membrane. The roofing membrane may include a first adhesive layer disposed on a major surface of the polymeric membrane. The first adhesive layer may include one or both of a hot melt adhesive and a butyl rubber-based adhesive. The roofing membrane may include a UV curable adhesive layer disposed on the first adhesive layer. The UV curable adhesive layer may have a thickness of less than about 4 mils.

The invention provides a synthetic rubber pressure-sensitive adhesive which has excellent heat resistance and substrate adhesiveness, is capable of inhibiting offset, peeling or the like even in a high-temperature environment and is suitable for applications in a high-temperature environment, a pressure-sensitive adhesive sheet and a polishing member laminate. The synthetic rubber pressure-sensitive adhesive of the invention contains: a synthetic rubber (A) including a styrene-isoprene block copolymer, an adhesion-imparting resin (B), and a fatty acid ester (C) with a weight reduction rate of 1 wt % or less after being heated at 150° C. for 10 minutes. Based on 100 parts by weight of the synthetic rubber (A), the content of the adhesion-imparting resin (B) is set as α parts by weight to 60 parts by weight, and the content of the fatty acid ester (C) is set as 0.1 parts by weight to 10 parts by weight.

The invention relates to a method for jacketing elongate articles, such as lines or cable harnesses in particular, by means of an adhesive tape comprising a tape-shaped substrate, which substrate has, on at least one side, a thermally curable, meltable, preferably pressure-sensitive adhesive layer, the adhesive layer comprising an epoxide-functionalized acrylonitrile-butadiene copolymer which has on average more than 1.5 epoxide groups per molecule and comprising the reaction product of phthalic anhydride and diethylene-triamine, the adhesive tape being led in a helix around the elongate article or the elongate article being enveloped by the adhesive tape in the axial direction, the elongate article together with the enveloping adhesive tape being brought into the desired arrangement, in particular into the cable harness plan, the elongate article being held in this arrangement, and the curable adhesive mass being cured by supplying thermal energy, in particular at a temperature of up to 110° C.

The invention relates to a method for jacketing elongate articles, such as lines or cable harnesses in particular, by means of an adhesive tape comprising a tape-shaped substrate, which substrate has, on at least one side, a thermally curable, meltable, preferably pressure-sensitive adhesive layer, the adhesive layer comprising an epoxide-functionalized acrylonitrile-butadiene copolymer which has on average more than 1.5 epoxide groups per molecule and comprising the reaction product of phthalic anhydride and diethylene-triamine, the adhesive tape being led in a helix around the elongate article or the elongate article being enveloped by the adhesive tape in the axial direction, the elongate article together with the enveloping adhesive tape being brought into the desired arrangement, in particular into the cable harness plan, the elongate article being held in this arrangement, and the curable adhesive mass being cured by supplying thermal energy, in particular at a temperature of up to 110° C.

An adhesive composition, a coverlay film containing the adhesive composition, and a printed circuit board containing the coverlay film are disclosed. The adhesive composition includes an epoxy resin, a binder resin containing at least one species of rubber, and an inorganic filler. The adhesive composition has a viscosity of at most 8,000 cps.

An adhesive composition, a coverlay film containing the adhesive composition, and a printed circuit board containing the coverlay film are disclosed. The adhesive composition includes an epoxy resin, a binder resin containing at least one species of rubber, and an inorganic filler. The adhesive composition has a viscosity of at most 8,000 cps.

The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

A thin adhesive tape includes a base and an adhesive layer provided on one surface of the base, wherein the base has a thickness of 2 to 25 μm, the adhesive layer has a thickness of 0.1 to 10 μm, the adhesive tape has a thickness of 30 μm or less, the adhesive tape has a peel adhesion of 0.50 N/10 mm or more in accordance with JIS Z 0237:2000, and the adhesive tape has a strength to repel members calculated by the following formula of 70 MPa.Math.mm or less, the adhesive tape being excellent in a balance between fixability of members and followability to members:
Strength to repel members (MPa.Math.mm)=tensile elastic modulus (MPa) of adhesive tape×thickness (mm) of adhesive tape.

A process for producing a cured pressure-sensitive adhesive that comprises a composition including at least one solid acrylonitrile-butadiene rubber, at least one tackifier resin, and optionally at least one liquid acrylonitrile-butadiene rubber, comprises subjecting the composition to electron-beam irradiation (EBC) with an acceleration voltage of 1.8 to 2.38 kV per 1 pm layer thickness of the composition and with a total beam dose of 5 to 50 kGy. Also disclosed is a cured pressure-sensitive adhesive obtained or obtainable by the process. Further disclosed is a double-sidedly adhering, especially carrierless, adhesive tape, and also single- or double-sidedly adhering adhesive tape comprising, on a carrier layer, the cured pressure-sensitive adhesive. Disclosed finally is the use of the pressure-sensitive adhesive or of an adhesive tape made therefrom for bonding components in electronic devices, especially in mobile electronic devices, preferably tablets, mobile phones or smart watches.

This invention relates to a heat and humidity resistant adhesive composition, comprising a first part comprising at least one ethylenically unsaturated monomer; a second part comprising at least one initiator; and at least one blocked isocyanate compound comprised in the first part, the second part and/or a third separate part. The adhesive composition exhibits excellent aging performance under rigorous conditions.